83649-66 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

83649-66: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.358 INCHES MAXIMUM IN, body_height: 0.120 INCHES MAXIMUM IN, body_length: 0.560 INCHES MAXIMUM IN, special_features: ADDING J-LEAD TO 5962-8952405YA, features_provided: ELECTROSTATIC SENSITIVE, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-463-0617, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

83649-66

NSN: 5962-01-463-0617
FSC: 5962 — Microcircuits, Electronic
CAGE: 35012 — GE AVIATION SYSTEMS LLC (USA)

SPECIFICATIONS

body_width	0.358 INCHES MAXIMUM IN
body_height	0.120 INCHES MAXIMUM IN
body_length	0.560 INCHES MAXIMUM IN
special_features	ADDING J-LEAD TO 5962-8952405YA
features_provided	ELECTROSTATIC SENSITIVE
inclosure_material	CERAMIC
memory_device_type	RAM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
end_item_identification	A/F-18 DCN CAGE 76301
inclosure_configuration	LEADED CHIP CARRIER
NSN	5962-01-463-0617

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.358 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.120 INCHES MAXIMUM IN

•

FEATURES PROVIDED: ELECTROSTATIC SENSITIVE

•

INCLOSURE CONFIGURATION: LEADED CHIP CARRIER

•

MEMORY DEVICE TYPE: RAM

•

BODY LENGTH: 0.560 INCHES MAXIMUM IN

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.358 INCHES MAXIMUM IN
BODY HEIGHT	0.120 INCHES MAXIMUM IN
FEATURES PROVIDED	ELECTROSTATIC SENSITIVE
INCLOSURE CONFIGURATION	LEADED CHIP CARRIER
MEMORY DEVICE TYPE	RAM
BODY LENGTH	0.560 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC
SPECIAL FEATURES	ADDING J-LEAD TO 5962-8952405YA

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES

No substitute or cross-reference records for this part.

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandNo demilitarization required

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FREQUENTLY ASKED QUESTIONS

What is 83649-66?

83649-66 is a MICROCIRCUIT,MEMORY.

What is the NSN for 83649-66?

83649-66 is cataloged in the U.S. Government catalog under NSN 5962-01-463-0617. This indicates validated use in U.S. government and defense supply chains.

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83649-66 — MICROCIRCUIT,MEMORY

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