83649-64 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

83649-64: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include special_features: ADDING J-LEAD TO 5962-8866207UA, features_provided: ELECTROSTATIC SENSITIVE, inclosure_material: CERAMIC, memory_device_type: RAM, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC, test_data_document: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-463-0614, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

83649-64

NSN: 5962-01-463-0614
FSC: 5962 — Microcircuits, Electronic
CAGE: 35012 — GE AVIATION SYSTEMS LLC (USA)

SPECIFICATIONS

special_features	ADDING J-LEAD TO 5962-8866207UA
features_provided	ELECTROSTATIC SENSITIVE
inclosure_material	CERAMIC
memory_device_type	RAM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
end_item_identification	A/F-18 DCN CAGE 76301
inclosure_configuration	LEADED CHIP CARRIER
terminal_surface_treatment	SOLDER
terminal_type_and_quantity	20 J-HOOK
maximum_power_dissipation_rating	1.0 WATTS
NSN	5962-01-463-0614

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

FEATURES PROVIDED: ELECTROSTATIC SENSITIVE

•

INCLOSURE CONFIGURATION: LEADED CHIP CARRIER

•

MEMORY DEVICE TYPE: RAM

•

STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC

•

VOLTAGE RATING AND TYPE PER CHARACTERISTIC: -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
FEATURES PROVIDED	ELECTROSTATIC SENSITIVE
INCLOSURE CONFIGURATION	LEADED CHIP CARRIER
MEMORY DEVICE TYPE	RAM
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC
SPECIAL FEATURES	ADDING J-LEAD TO 5962-8866207UA
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	-0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE
OPERATING TEMP RANGE	-55.0 TO 125.0 CELSIUS DEGC
PART NAME ASSIGNED BY CONTROLLING AGENCY	CERAMIC CHIP CARRIER ASSY, FLAT J-LEAD

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES

No substitute or cross-reference records for this part.

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandNo demilitarization required

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FREQUENTLY ASKED QUESTIONS

What is 83649-64?

83649-64 is a MICROCIRCUIT,MEMORY.

What is the NSN for 83649-64?

83649-64 is cataloged in the U.S. Government catalog under NSN 5962-01-463-0614. This indicates validated use in U.S. government and defense supply chains.

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83649-64 — MICROCIRCUIT,MEMORY

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