83649-54: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 1.060 INCHES MAXIMUM IN, special_features: ADDING J-LEAD TO M38510/75503B2A, features_provided: ELECTROSTATIC SENSITIVE, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-463-0610, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.310 INCHES MAXIMUM IN |
| body_height | 0.185 INCHES MAXIMUM IN |
| body_length | 1.060 INCHES MAXIMUM IN |
| special_features | ADDING J-LEAD TO M38510/75503B2A |
| features_provided | ELECTROSTATIC SENSITIVE |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| end_item_identification | A/F-18 DCN CANG 76301 |
| inclosure_configuration | LEADED CHIP CARRIER |
| NSN | 5962-01-463-0610 |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| DESIGN FUNCTION AND QUANTITY | 1 TRANSCEIVER |
| BODY WIDTH | 0.310 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.185 INCHES MAXIMUM IN |
| FEATURES PROVIDED | ELECTROSTATIC SENSITIVE |
| INCLOSURE CONFIGURATION | LEADED CHIP CARRIER |
| BODY LENGTH | 1.060 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
No substitute or cross-reference records for this part.