8300-281: MICROCIRCUIT,HYBRID.
The MICROCIRCUIT,HYBRID is a the manufacturer industrial component. Key specifications include body_width: 1.095 INCHES MAXIMUM IN, body_height: 0.350 INCHES MAXIMUM IN, body_length: 1.595 INCHES MAXIMUM IN, features_provided: ELECTROSTATIC SENSITIVE AND BURN IN AND TESTED TO MIL-STD-883, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: METAL. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-322-1006, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 1.095 INCHES MAXIMUM IN |
| body_height | 0.350 INCHES MAXIMUM IN |
| body_length | 1.595 INCHES MAXIMUM IN |
| features_provided | ELECTROSTATIC SENSITIVE AND BURN IN AND TESTED TO MIL-STD-883 |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | METAL |
| storage_temp_range | -62.0 TO 125.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD 883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -54.0 TO 85.0 CELSIUS DEGC |
| hybrid_technology_type | FILM AND MULTICHIP |
| inclosure_configuration | AXIAL QUAD ARRAY |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-01-322-1006 |
| HYBRID TECHNOLOGY TYPE | FILM AND MULTICHIP |
| INCLOSURE MATERIAL | METAL |
| TERMINAL SURFACE TREATMENT | SOLDER |
| DESIGN FUNCTION AND QUANTITY | 1 OSCILLATOR |
| BODY WIDTH | 1.095 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.350 INCHES MAXIMUM IN |
| FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND BURN IN AND TESTED TO MIL-STD-883 |
| INCLOSURE CONFIGURATION | AXIAL QUAD ARRAY |
| CURRENT RATING PER CHARACTERISTIC | 40.00 MILLIAMPERES MAXIMUM SUPPLY |
| BODY LENGTH | 1.595 INCHES MAXIMUM IN |