82S141/BKA — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

82S141/BKA: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 1.250 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND BIPOLAR AND PROGRAMMABLE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-098-6568, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

82S141/BKA

NSN: 5962-01-098-6568
FSC: 5962 — Microcircuits, Electronic
CAGE: 18324 — PHILIPS SEMICONDUCTORS INC (USA)

SPECIFICATIONS

body_width	0.310 INCHES MAXIMUM IN
body_height	0.185 INCHES MAXIMUM IN
body_length	1.250 INCHES MAXIMUM IN
features_provided	MONOLITHIC AND BIPOLAR AND PROGRAMMABLE
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	PROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	12 INPUT
end_item_identification	AN/ASB-15
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-098-6568

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 12 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.310 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.185 INCHES MAXIMUM IN

•

FEATURES PROVIDED: MONOLITHIC AND BIPOLAR AND PROGRAMMABLE

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: PROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	12 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.310 INCHES MAXIMUM IN
BODY HEIGHT	0.185 INCHES MAXIMUM IN
FEATURES PROVIDED	MONOLITHIC AND BIPOLAR AND PROGRAMMABLE
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	PROM
BODY LENGTH	1.250 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 1

ROM/PROM FAMILY 045Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is 82S141/BKA?

82S141/BKA is a MICROCIRCUIT,MEMORY.

What parts can replace 82S141/BKA?

There is 1 known substitute for 82S141/BKA: ROM/PROM FAMILY 045. Substitute compatibility should be verified for your specific system.

What is the NSN for 82S141/BKA?

82S141/BKA is cataloged in the U.S. Government catalog under NSN 5962-01-098-6568. This indicates validated use in U.S. government and defense supply chains.

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