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Technical Data Sheet

82S137A/BVA — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

82S137A/BVA: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 0.960 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: HERMETICALLY SEALED AND BURN IN AND BIPOLAR AND PROGRAMMABLE AND W/ENABLE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-251-5930, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
82S137A/BVA
NSN: 5962-01-251-5930
FSC: 5962 — Microcircuits, Electronic
CAGE: 18324 — PHILIPS SEMICONDUCTORS INC (USA)
SPECIFICATIONS
body_width0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height0.185 INCHES MAXIMUM IN
body_length0.960 INCHES MAXIMUM IN
memory_capacityUNKNOWN
features_providedHERMETICALLY SEALED AND BURN IN AND BIPOLAR AND PROGRAMMABLE AND W/ENABLE
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC
memory_device_typePROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern12 INPUT
NSN5962-01-251-5930
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 82S137A/BVA MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 12 INPUT
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.185 INCHES MAXIMUM IN
•
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND BIPOLAR AND PROGRAMMABLE AND W/ENABLE
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
MEMORY DEVICE TYPE: PROM
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN12 INPUT
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
BODY HEIGHT0.185 INCHES MAXIMUM IN
FEATURES PROVIDEDHERMETICALLY SEALED AND BURN IN AND BIPOLAR AND PROGRAMMABLE AND W/ENABLE
INCLOSURE CONFIGURATIONDUAL-IN-LINE
MEMORY DEVICE TYPEPROM
CASE OUTLINE SOURCE AND DESIGNATORD-6 MIL-M-38510
BODY LENGTH0.960 INCHES MAXIMUM IN
OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic
Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.
5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909
SUBSTITUTES & CROSS-REFERENCES 2
A1148938Same NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
ROM/PROMReference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)
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FREQUENTLY ASKED QUESTIONS
What is 82S137A/BVA?
82S137A/BVA is a MICROCIRCUIT,MEMORY.
What parts can replace 82S137A/BVA?
There are 2 known substitutes for 82S137A/BVA: A1148938, ROM/PROM. Substitute compatibility should be verified for your specific system.
What is the NSN for 82S137A/BVA?
82S137A/BVA is cataloged in the U.S. Government catalog under NSN 5962-01-251-5930. This indicates validated use in U.S. government and defense supply chains.
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