82S129AW — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

82S129AW: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.245 INCHES MINIMUM AND 0.275 INCHES MAXIMUM IN, body_height: 0.055 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN, body_length: 0.370 INCHES MINIMUM AND 0.395 INCHES MAXIMUM IN, overall_width: 0.940 INCHES MINIMUM AND 0.960 INCHES MAXIMUM IN, features_provided: BIPOLAR AND MONOLITHIC AND W/ENABLE AND 3-STATE OUTPUT AND PROGRAMMABLE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-283-6850, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

82S129AW

NSN: 5962-01-283-6850
FSC: 5962 — Microcircuits, Electronic
CAGE: 18324 — PHILIPS SEMICONDUCTORS INC (USA)

SPECIFICATIONS

body_width	0.245 INCHES MINIMUM AND 0.275 INCHES MAXIMUM IN
body_height	0.055 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN
body_length	0.370 INCHES MINIMUM AND 0.395 INCHES MAXIMUM IN
overall_width	0.940 INCHES MINIMUM AND 0.960 INCHES MAXIMUM IN
features_provided	BIPOLAR AND MONOLITHIC AND W/ENABLE AND 3-STATE OUTPUT AND PROGRAMMABLE
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	10 INPUT
inclosure_configuration	FLAT PACK
NSN	5962-01-283-6850

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 10 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.245 INCHES MINIMUM AND 0.275 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.055 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN

•

FEATURES PROVIDED: BIPOLAR AND MONOLITHIC AND W/ENABLE AND 3-STATE OUTPUT AND PROGRAMMABLE

•

INCLOSURE CONFIGURATION: FLAT PACK

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	10 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.245 INCHES MINIMUM AND 0.275 INCHES MAXIMUM IN
BODY HEIGHT	0.055 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN
OVERALL WIDTH	0.940 INCHES MINIMUM AND 0.960 INCHES MAXIMUM IN
FEATURES PROVIDED	BIPOLAR AND MONOLITHIC AND W/ENABLE AND 3-STATE OUTPUT AND PROGRAMMABLE
INCLOSURE CONFIGURATION	FLAT PACK
MEMORY DEVICE TYPE	ROM
BODY LENGTH	0.370 INCHES MINIMUM AND 0.395 INCHES MAXIMUM IN

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 2

CC8126-3WReference document

Same NSN cross-reference

Reference document — Secondary reference

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 82S129AW?

82S129AW is a MICROCIRCUIT,MEMORY.

What parts can replace 82S129AW?

There are 2 known substitutes for 82S129AW: CC8126-3W, ROM/PROM. Substitute compatibility should be verified for your specific system.

What is the NSN for 82S129AW?

82S129AW is cataloged in the U.S. Government catalog under NSN 5962-01-283-6850. This indicates validated use in U.S. government and defense supply chains.

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