82S114T — MICROCIRCUIT,DIGITAL

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

82S114T: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.580 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN, body_height: 0.080 INCHES MINIMUM AND 0.120 INCHES MAXIMUM IN, body_length: 1.100 INCHES MINIMUM AND 1.250 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND PROGRAMMED AND W/DISABLE AND W/ENABLE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-024-4406, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

82S114T

NSN: 5962-01-024-4406
FSC: 5962 — Microcircuits, Electronic
CAGE: 18324 — PHILIPS SEMICONDUCTORS INC (USA)

SPECIFICATIONS

body_width	0.580 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
body_height	0.080 INCHES MINIMUM AND 0.120 INCHES MAXIMUM IN
body_length	1.100 INCHES MINIMUM AND 1.250 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND PROGRAMMED AND W/DISABLE AND W/ENABLE
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	8 INPUT
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
NSN	5962-01-024-4406

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 8 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.580 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.080 INCHES MINIMUM AND 0.120 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND PROGRAMMED AND W/DISABLE AND W/ENABLE

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	8 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.580 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
BODY HEIGHT	0.080 INCHES MINIMUM AND 0.120 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND PROGRAMMED AND W/DISABLE AND W/ENABLE
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	1.100 INCHES MINIMUM AND 1.250 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 4

CB10058204Reference document

Same NSN cross-reference

Reference document — Secondary reference

S82S114IReference document

Same NSN cross-reference

Reference document — Secondary reference

MM5246DReference document

Same NSN cross-reference

Reference document — Secondary reference

5246DReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is 82S114T?

82S114T is a MICROCIRCUIT,DIGITAL.

What parts can replace 82S114T?

There are 4 known substitutes for 82S114T: CB10058204, S82S114I, MM5246D and 1 more. Substitute compatibility should be verified for your specific system.

What is the NSN for 82S114T?

82S114T is cataloged in the U.S. Government catalog under NSN 5962-01-024-4406. This indicates validated use in U.S. government and defense supply chains.

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