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82S09 ✓ Verified by PartsTable
— · COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.570 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN, body_height: 0.080 INCHES MINIMUM AND 0.120 INCHES MAXIMUM IN, body_length: 1.380 INCHES MINIMUM AND 1.430 INCHES MAXIMUM IN, bit_quantity: 576, word_quantity: 64, features_provided: HERMETICALLY SEALED AND BIPOLAR AND W/ENABLE AND W/OPEN COLLECTOR AND SCHOTTKY. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-157-3651, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
82S09
NSN: 5962-01-157-3651
FSC: 5962
CAGE: 18324 — PHILIPS SEMICONDUCTORS INC (USA)
SPECIFICATIONS
body_width0.570 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
body_height0.080 INCHES MINIMUM AND 0.120 INCHES MAXIMUM IN
body_length1.380 INCHES MINIMUM AND 1.430 INCHES MAXIMUM IN
bit_quantity576
word_quantity64
features_providedHERMETICALLY SEALED AND BIPOLAR AND W/ENABLE AND W/OPEN COLLECTOR AND SCHOTTKY
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeRAM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 85.0 CELSIUS DEGC
input_circuit_pattern17 INPUT
NSN5962-01-157-3651
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 82S09 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INCLOSURE MATERIAL: CERAMIC
•
TIME RATING PER CHACTERISTIC: 80.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT NS
•
BODY HEIGHT: 0.080 INCHES MINIMUM AND 0.120 INCHES MAXIMUM IN
•
FEATURES PROVIDED: HERMETICALLY SEALED AND BIPOLAR AND W/ENABLE AND W/OPEN COLLECTOR AND SCHOTTKY
•
TERMINAL TYPE AND QUANTITY: 28 PRINTED CIRCUIT
•
TEST DATA DOCUMENT: 80063-SM-A-838094 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING)
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
MEMORY DEVICE TYPE: RAM
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
INCLOSURE MATERIALCERAMIC
TIME RATING PER CHACTERISTIC80.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT NS
BODY HEIGHT0.080 INCHES MINIMUM AND 0.120 INCHES MAXIMUM IN
FEATURES PROVIDEDHERMETICALLY SEALED AND BIPOLAR AND W/ENABLE AND W/OPEN COLLECTOR AND SCHOTTKY
TERMINAL TYPE AND QUANTITY28 PRINTED CIRCUIT
TEST DATA DOCUMENT80063-SM-A-838094 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING)
INCLOSURE CONFIGURATIONDUAL-IN-LINE
MEMORY DEVICE TYPERAM
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
TERMINAL SURFACE TREATMENTSOLDER
VERIFIED SUBSTITUTES & CROSS-REFERENCES 11
3310-011Interchangeable
interchangeable cross-reference
interchangeable
308731-2Interchangeable
interchangeable cross-reference
interchangeable
4014583-001Interchangeable
interchangeable cross-reference
interchangeable
7530-01-106-4725Interchangeable
interchangeable cross-reference
interchangeable
7530PL1286758Interchangeable
interchangeable cross-reference
interchangeable
SM-A-838094-1Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 82S09?
82S09 is a MICROCIRCUIT,MEMORY.
What parts can replace 82S09?
There are 11 known substitutes for 82S09: 3310-011, 308731-2, 4014583-001 and 8 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 82S09?
82S09 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-157-3651. This indicates validated use in U.S. government and defense supply chains.
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✓ Validated with multiple authoritative sources, including Government, OEM, and Certified sources.
PartsTable Design LLC · partstable.com
Last verified: July 2026