82C55A: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.470 INCHES NOMINAL IN, body_height: 0.190 INCHES MAXIMUM IN, body_length: 2.020 INCHES MAXIMUM IN, overall_width: 0.610 INCHES MAXIMUM IN, overall_height: 0.349 INCHES MAXIMUM IN, overall_length: 2.020 INCHES MAXIMUM IN. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-246-8722, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.470 INCHES NOMINAL IN |
| body_height | 0.190 INCHES MAXIMUM IN |
| body_length | 2.020 INCHES MAXIMUM IN |
| overall_width | 0.610 INCHES MAXIMUM IN |
| overall_height | 0.349 INCHES MAXIMUM IN |
| overall_length | 2.020 INCHES MAXIMUM IN |
| features_provided | BURN IN AND BIDIRECTIONAL AND HIGH SPEED AND LOW POWER AND W/RESET |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | PAL |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | +0.0 TO 70.0 CELSIUS DEGC |
| NSN | 5962-01-246-8722 |
| INPUT CIRCUIT PATTERN | 38 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 0.620 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.210 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND MONOLITHIC |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CURRENT RATING PER CHARACTERISTIC | 10.00 MICROAMPERES NOMINAL TOTAL SUPPLY |
| MEMORY DEVICE TYPE | PAL |
| CASE OUTLINE SOURCE AND DESIGNATOR | D-5 MIL-M-38510 |