Name: MICROCIRCUIT,MEMORY
Brand: Unknown
SKU: 8202504YX

8202504YX ✓ Verified by PartsTable

— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN, body_height: 0.165 INCHES MAXIMUM IN, body_length: 1.490 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE AND MONOLITHIC, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-259-6501, indicating validated use in U.S.

government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

8202504YX

NSN: 5962-01-259-6501
FSC: 5962
CAGE: 67268 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (STANDARD MICROCIRCUIT (USA)

SPECIFICATIONS

body_width	0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
body_height	0.165 INCHES MAXIMUM IN
body_length	1.490 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE AND MONOLITHIC
output_logic_form	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	PROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	17 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-259-6501

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

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INCLOSURE MATERIAL: CERAMIC

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INPUT CIRCUIT PATTERN: 17 INPUT

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OUTPUT LOGIC FORM: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC

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OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC

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TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).

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TERMINAL SURFACE TREATMENT: SOLDER

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TIME RATING PER CHACTERISTIC: 300.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 300.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS (FLIS)

INCLOSURE CONFIGURATION	DUAL-IN-LINE
INCLOSURE MATERIAL	CERAMIC
INPUT CIRCUIT PATTERN	17 INPUT
OUTPUT LOGIC FORM	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
OPERATING TEMP RANGE	-55.0 TO 125.0 CELSIUS DEGC
TEST DATA DOCUMENT	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
TERMINAL SURFACE TREATMENT	SOLDER
TIME RATING PER CHACTERISTIC	300.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 300.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
CURRENT RATING PER CHARACTERISTIC	50.00 MILLIAMPERES NOMINAL TOTAL SUPPLY
CASE OUTLINE SOURCE AND DESIGNATOR	D-10 MIL-M-38510

VERIFIED SUBSTITUTES & CROSS-REFERENCES 27

82025Interchangeable