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Technical Data Sheet
PartsTable / COMPONENT / 8201004EB
8201004EB ✓ Verified by PartsTable
— · COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 0.840 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND DYNAMIC AND W/CLOCK AND W/BUFFERED OUTPUT, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-246-8192, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
8201004EB
NSN: 5962-01-246-8192
FSC: 5962
CAGE: 67268 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (STANDARD MICROCIRCUIT (USA)
SPECIFICATIONS
body_width0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height0.185 INCHES MAXIMUM IN
body_length0.840 INCHES MAXIMUM IN
features_providedHERMETICALLY SEALED AND BURN IN AND DYNAMIC AND W/CLOCK AND W/BUFFERED OUTPUT
output_logic_formN-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeRAM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern12 INPUT
inclosure_configurationDUAL-IN-LINE
terminal_surface_treatmentSOLDER
NSN5962-01-246-8192
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 8201004EB MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INCLOSURE MATERIAL: CERAMIC
•
BODY LENGTH: 0.840 INCHES MAXIMUM IN
•
OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC
•
BODY HEIGHT: 0.185 INCHES MAXIMUM IN
•
TIME RATING PER CHACTERISTIC: 150.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 150.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
•
CASE OUTLINE SOURCE AND DESIGNATOR: D-2 MIL-M-38510
•
TERMINAL TYPE AND QUANTITY: 16 PRINTED CIRCUIT
•
MEMORY DEVICE TYPE: RAM
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
INCLOSURE MATERIALCERAMIC
BODY LENGTH0.840 INCHES MAXIMUM IN
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
BODY HEIGHT0.185 INCHES MAXIMUM IN
TIME RATING PER CHACTERISTIC150.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 150.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
CASE OUTLINE SOURCE AND DESIGNATORD-2 MIL-M-38510
TERMINAL TYPE AND QUANTITY16 PRINTED CIRCUIT
MEMORY DEVICE TYPERAM
TERMINAL SURFACE TREATMENTSOLDER
TEST DATA DOCUMENT14933-82010 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING)
VERIFIED SUBSTITUTES & CROSS-REFERENCES 23
82010Interchangeable
interchangeable cross-reference
interchangeable
40517Interchangeable
interchangeable cross-reference
interchangeable
TP-2029Interchangeable
interchangeable cross-reference
interchangeable
425020-5000HInterchangeable
interchangeable cross-reference
interchangeable
5000HInterchangeable
interchangeable cross-reference
interchangeable
801042Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 8201004EB?
8201004EB is a MICROCIRCUIT,MEMORY.
What parts can replace 8201004EB?
There are 23 known substitutes for 8201004EB: 82010, 40517, TP-2029 and 20 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 8201004EB?
8201004EB is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-246-8192. This indicates validated use in U.S. government and defense supply chains.
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PartsTable Design LLC · partstable.com
Last verified: July 2026