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Technical Data Sheet
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8200902KB ✓ Verified by PartsTable
— · COMPONENT
WHAT YOU NEED TO KNOW
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PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.420 INCHES MAXIMUM IN, body_height: 0.090 INCHES MAXIMUM IN, body_length: 0.640 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND 3-STATE OUTPUT AND MONOLITHIC, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-264-5235, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
8200902KB
NSN: 5962-01-264-5235
FSC: 5962
CAGE: 67268 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (STANDARD MICROCIRCUIT (USA)
SPECIFICATIONS
body_width0.420 INCHES MAXIMUM IN
body_height0.090 INCHES MAXIMUM IN
body_length0.640 INCHES MAXIMUM IN
features_providedHERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND 3-STATE OUTPUT AND MONOLITHIC
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC AND GLASS
memory_device_typePROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern14 INPUT
inclosure_configurationFLAT PACK
NSN5962-01-264-5235
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 8200902KB MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INCLOSURE CONFIGURATION: FLAT PACK
•
INCLOSURE MATERIAL: CERAMIC AND GLASS
•
BODY HEIGHT: 0.090 INCHES MAXIMUM IN
•
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
•
TIME RATING PER CHACTERISTIC: 55.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 55.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
•
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS MAXIMUM POWER SOURCE
•
TERMINAL SURFACE TREATMENT: SOLDER
•
TERMINAL TYPE AND QUANTITY: 24 FLAT LEADS
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
INCLOSURE CONFIGURATIONFLAT PACK
INCLOSURE MATERIALCERAMIC AND GLASS
BODY HEIGHT0.090 INCHES MAXIMUM IN
TEST DATA DOCUMENT96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
TIME RATING PER CHACTERISTIC55.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 55.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
VOLTAGE RATING AND TYPE PER CHARACTERISTIC7.0 VOLTS MAXIMUM POWER SOURCE
TERMINAL SURFACE TREATMENTSOLDER
TERMINAL TYPE AND QUANTITY24 FLAT LEADS
CASE OUTLINE SOURCE AND DESIGNATORF-6 MIL-M-38510
MEMORY DEVICE TYPEPROM
VERIFIED SUBSTITUTES & CROSS-REFERENCES 23
82009Interchangeable
interchangeable cross-reference
interchangeable
99254574Interchangeable
interchangeable cross-reference
interchangeable
2500HInterchangeable
interchangeable cross-reference
interchangeable
B6038CInterchangeable
interchangeable cross-reference
interchangeable
3-5020452AC5AXA 8957431-2009Interchangeable
interchangeable cross-reference
interchangeable
51T6038AInterchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 8200902KB?
8200902KB is a MICROCIRCUIT,MEMORY.
What parts can replace 8200902KB?
There are 23 known substitutes for 8200902KB: 82009, 99254574, 2500H and 20 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 8200902KB?
8200902KB is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-264-5235. This indicates validated use in U.S. government and defense supply chains.
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Last verified: July 2026