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82008B3KA — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

82008B3KA: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include special_features: ELECTROSTATIC DISCHARGE SENSITIVE, features_provided: PROGRAMMABLE AND ELECTROSTATIC SENSITIVE AND MONOLITHIC AND BIPOLAR AND HIGH RELIABILITY, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, memory_device_type: PROM, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-289-2974, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
82008B3KA
NSN: 5962-01-289-2974
FSC: 5962 — Microcircuits, Electronic
CAGE: 16236 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (VENDOR ITEM DRAWINGS) (USA)
SPECIFICATIONS
special_featuresELECTROSTATIC DISCHARGE SENSITIVE
features_providedPROGRAMMABLE AND ELECTROSTATIC SENSITIVE AND MONOLITHIC AND BIPOLAR AND HIGH RELIABILITY
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
memory_device_typePROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
hybrid_technology_typeMONOLITHIC
inclosure_configurationFLAT PACK
terminal_type_and_quantity24 PIN
criticality_code_justificationFEAT
case_outline_source_and_designatorF-6 MIL-M-38510
NSN5962-01-289-2974
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 82008B3KA MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
HYBRID TECHNOLOGY TYPE: MONOLITHIC
•
CRITICALITY CODE JUSTIFICATION: FEAT
•
FEATURES PROVIDED: PROGRAMMABLE AND ELECTROSTATIC SENSITIVE AND MONOLITHIC AND BIPOLAR AND HIGH RELIABILITY
•
INCLOSURE CONFIGURATION: FLAT PACK
•
MEMORY DEVICE TYPE: PROM
•
CASE OUTLINE SOURCE AND DESIGNATOR: F-6 MIL-M-38510
•
STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC
•
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
HYBRID TECHNOLOGY TYPEMONOLITHIC
CRITICALITY CODE JUSTIFICATIONFEAT
FEATURES PROVIDEDPROGRAMMABLE AND ELECTROSTATIC SENSITIVE AND MONOLITHIC AND BIPOLAR AND HIGH RELIABILITY
INCLOSURE CONFIGURATIONFLAT PACK
MEMORY DEVICE TYPEPROM
CASE OUTLINE SOURCE AND DESIGNATORF-6 MIL-M-38510
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
OUTPUT LOGIC FORMTRANSISTOR-TRANSISTOR LOGIC
SPECIAL FEATURESELECTROSTATIC DISCHARGE SENSITIVE
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
SUBSTITUTES & CROSS-REFERENCES 3
8200803KASame NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
ROM/PROMReference document
Same NSN cross-reference
Reference document — Secondary reference
7570984-100Reference document
Same NSN cross-reference
Reference document — Design control — primary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Terminal item — no further procurement; issued until stock is exhaustedNo demilitarization required
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FREQUENTLY ASKED QUESTIONS
What is 82008B3KA?
82008B3KA is a MICROCIRCUIT,MEMORY.
What parts can replace 82008B3KA?
There are 3 known substitutes for 82008B3KA: 8200803KA, ROM/PROM, 7570984-100. Substitute compatibility should be verified for your specific system.
What is the NSN for 82008B3KA?
82008B3KA is cataloged in the U.S. Government catalog under NSN 5962-01-289-2974. This indicates validated use in U.S. government and defense supply chains.
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