8200803JA — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

8200803JA: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.610 INCHES MAXIMUM IN, body_height: 0.150 INCHES MAXIMUM IN, body_length: 1.290 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, special_features: NUCLEAR HARDNESS CRITICAL ITEM, features_provided: MONOLITHIC AND PROGRAMMABLE AND SCHOTTKY AND BIPOLAR. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-332-0724, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

8200803JA

NSN: 5962-01-332-0724
NIINs: 013320724, 013320726, 013740092, 013740093
FSC: 5962 — Microcircuits, Electronic
CAGE: 67268 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (STANDARD MICROCIRCUIT (USA)

SPECIFICATIONS

body_width	0.610 INCHES MAXIMUM IN
body_height	0.150 INCHES MAXIMUM IN
body_length	1.290 INCHES MAXIMUM IN
memory_capacity	UNKNOWN
special_features	NUCLEAR HARDNESS CRITICAL ITEM
features_provided	MONOLITHIC AND PROGRAMMABLE AND SCHOTTKY AND BIPOLAR
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
NSN	5962-01-332-0724

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 14 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.610 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.150 INCHES MAXIMUM IN

•

FEATURES PROVIDED: MONOLITHIC AND PROGRAMMABLE AND SCHOTTKY AND BIPOLAR

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	14 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.610 INCHES MAXIMUM IN
BODY HEIGHT	0.150 INCHES MAXIMUM IN
FEATURES PROVIDED	MONOLITHIC AND PROGRAMMABLE AND SCHOTTKY AND BIPOLAR
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
CASE OUTLINE SOURCE AND DESIGNATOR	D-3 MIL-M-38510
BODY LENGTH	1.290 INCHES MAXIMUM IN

SUBSTITUTES & CROSS-REFERENCES 3

5962-8200803BJAReference document

Same NSN cross-reference

Reference document — Secondary reference

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

113A158-08-010Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 8200803JA?

8200803JA is a MICROCIRCUIT,MEMORY.

What parts can replace 8200803JA?

There are 3 known substitutes for 8200803JA: 5962-8200803BJA, ROM/PROM, 113A158-08-010. Substitute compatibility should be verified for your specific system.

What is the NSN for 8200803JA?

8200803JA is cataloged in the U.S. Government catalog under NSN 5962-01-332-0724. This indicates validated use in U.S. government and defense supply chains.

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