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Technical Data Sheet
PartsTable / COMPONENT / 8200802JB
8200802JB ✓ Verified by PartsTable
— · COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.610 INCHES MAXIMUM IN, body_height: 0.210 INCHES MAXIMUM IN, body_length: 1.290 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND SCHOTTKY AND PROGRAMMABLE AND BIPOLAR AND 3-STATE OUTPUT, output_logic_form: BIPOLAR METAL-OXIDE SEMICONDUCTOR, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-400-6120, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
8200802JB
NSN: 5962-01-400-6120
FSC: 5962
CAGE: 67268 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (STANDARD MICROCIRCUIT (USA)
SPECIFICATIONS
body_width0.610 INCHES MAXIMUM IN
body_height0.210 INCHES MAXIMUM IN
body_length1.290 INCHES MAXIMUM IN
features_providedHERMETICALLY SEALED AND BURN IN AND SCHOTTKY AND PROGRAMMABLE AND BIPOLAR AND 3-STATE OUTPUT
output_logic_formBIPOLAR METAL-OXIDE SEMICONDUCTOR
inclosure_materialCERAMIC
memory_device_typeROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
inclosure_configurationDUAL-IN-LINE
terminal_surface_treatmentSOLDER
terminal_type_and_quantity24 PRINTED CIRCUIT
NSN5962-01-400-6120
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 8200802JB MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND SCHOTTKY AND PROGRAMMABLE AND BIPOLAR AND 3-STATE OUTPUT
•
OUTPUT LOGIC FORM: BIPOLAR METAL-OXIDE SEMICONDUCTOR
•
MEMORY DEVICE TYPE: ROM
•
CASE OUTLINE SOURCE AND DESIGNATOR: D-3 MIL-M-38510
•
TIME RATING PER CHACTERISTIC: 55.00 NANOSECONDS MAXIMUM ACCESS NS
•
TERMINAL TYPE AND QUANTITY: 24 PRINTED CIRCUIT
•
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS MAXIMUM POWER SOURCE
•
TERMINAL SURFACE TREATMENT: SOLDER
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
FEATURES PROVIDEDHERMETICALLY SEALED AND BURN IN AND SCHOTTKY AND PROGRAMMABLE AND BIPOLAR AND 3-STATE OUTPUT
OUTPUT LOGIC FORMBIPOLAR METAL-OXIDE SEMICONDUCTOR
MEMORY DEVICE TYPEROM
CASE OUTLINE SOURCE AND DESIGNATORD-3 MIL-M-38510
TIME RATING PER CHACTERISTIC55.00 NANOSECONDS MAXIMUM ACCESS NS
TERMINAL TYPE AND QUANTITY24 PRINTED CIRCUIT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC7.0 VOLTS MAXIMUM POWER SOURCE
TERMINAL SURFACE TREATMENTSOLDER
CURRENT RATING PER CHARACTERISTIC100.00 MILLIAMPERES NOMINAL OUTPUT
INCLOSURE CONFIGURATIONDUAL-IN-LINE
VERIFIED SUBSTITUTES & CROSS-REFERENCES 24
B18.2.1Interchangeable
interchangeable cross-reference
interchangeable
MS35355-67Interchangeable
interchangeable cross-reference
interchangeable
426927Interchangeable
interchangeable cross-reference
interchangeable
82008Interchangeable
interchangeable cross-reference
interchangeable
2140130Interchangeable
interchangeable cross-reference
interchangeable
667770Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 8200802JB?
8200802JB is a MICROCIRCUIT,MEMORY.
What parts can replace 8200802JB?
There are 24 known substitutes for 8200802JB: B18.2.1, MS35355-67, 426927 and 21 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 8200802JB?
8200802JB is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-400-6120. This indicates validated use in U.S. government and defense supply chains.
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PartsTable Design LLC · partstable.com
Last verified: July 2026