Name: MICROCIRCUIT,MEMORY
Brand: Unknown
SKU: 8200702RX

8200702RX ✓ Verified by PartsTable

— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.130 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN, body_length: 1.060 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND STATIC OPERATION, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-337-6505, indicating validated use in U.S.

government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

8200702RX

NSN: 5962-01-337-6505
FSC: 5962
CAGE: 67268 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (STANDARD MICROCIRCUIT (USA)

SPECIFICATIONS

body_width	0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height	0.130 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
body_length	1.060 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND STATIC OPERATION
output_logic_form	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	RAM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	17 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-337-6505

COMPONENT DIAGRAM

KEY FEATURES

•

CASE OUTLINE SOURCE AND DESIGNATOR: D-8 MIL-M-38510

•

OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC

•

OUTPUT LOGIC FORM: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC

•

FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND STATIC OPERATION

•

TERMINAL SURFACE TREATMENT: SOLDER

•

TIME RATING PER CHACTERISTIC: 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS

•

TERMINAL TYPE AND QUANTITY: 20 PRINTED CIRCUIT

•

VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS MAXIMUM POWER SOURCE

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS (FLIS)

CASE OUTLINE SOURCE AND DESIGNATOR	D-8 MIL-M-38510
OPERATING TEMP RANGE	-55.0 TO 125.0 CELSIUS DEGC
OUTPUT LOGIC FORM	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND STATIC OPERATION
TERMINAL SURFACE TREATMENT	SOLDER
TIME RATING PER CHACTERISTIC	70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
TERMINAL TYPE AND QUANTITY	20 PRINTED CIRCUIT
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	7.0 VOLTS MAXIMUM POWER SOURCE
MEMORY DEVICE TYPE	RAM
TEST DATA DOCUMENT	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).

VERIFIED SUBSTITUTES & CROSS-REFERENCES 18

82007Interchangeable