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8200-034 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

8200-034: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include material: GLASS, edge_type: BEVELED, surface_finish: FINE GROUND ONE SIDE AND POLISHED WITH RIM AND CHAMFERS GROUND OTHER SIDE, memory_capacity: 16K X8, overall_diameter: 0.492 INCHES MINIMUM AND 0.500 INCHES MAXIMUM IN, style_designator: CIRCULAR. This part is cataloged in the U.S.

Government catalog under NSN 9340-00-541-8243, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
8200-034
NSN: 9340-00-541-8243
NIINs: 005418243, 012771749, 013982375, 015490238
FSC: 9340 — Glass Fabricated Materials
CAGE: 19200 — COMBAT CAPABILITIES DEVELOPMENT COMMAND (CCDC) ARMAMENTS CENTER DBA CCDC DIV LOGISTICS RESEARCH AND ENGINEERING DIRECTORATE (USA)
SPECIFICATIONS
materialGLASS
edge_typeBEVELED
ply_quantity1
surface_finishFINE GROUND ONE SIDE AND POLISHED WITH RIM AND CHAMFERS GROUND OTHER SIDE
memory_capacity16K X8
overall_diameter0.492 INCHES MINIMUM AND 0.500 INCHES MAXIMUM IN
special_featuresFAILURE RATE: 1.498/1.000,000 HOURS; MAXIMUM POWER DISSIPATION: 1.0 WATT; CONSISTS OF A 16K X8 ULTRAVIOLET-ERASABLE AND ELECTRICALLY PROGRAMMABLE READ-ONLY MEMORY.
style_designatorCIRCULAR
overall_thickness0.100 INCHES MINIMUM AND 0.110 INCHES MAXIMUM IN
memory_device_typeEPROM
material_transparencyCLEAR
supplementary_featuresTTL COMPATIBLE, WITH 3-STATE OUTPUT CAPABILITY
NSN9340-00-541-8243
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 8200-034 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
OVERALL DIAMETER: 0.492 INCHES MINIMUM AND 0.500 INCHES MAXIMUM IN
•
SURFACE FINISH: FINE GROUND ONE SIDE AND POLISHED WITH RIM AND CHAMFERS GROUND OTHER SIDE
•
OVERALL THICKNESS: 0.100 INCHES MINIMUM AND 0.110 INCHES MAXIMUM IN
•
MATERIAL TRANSPARENCY: CLEAR
•
STYLE DESIGNATOR: CIRCULAR
•
MATERIAL DOCUMENT AND CLASSIFICATION: DD-G-451 FED SPEC SINGLE MATERIAL RESPONSE
•
EDGE TYPE: BEVELED
•
PLY QUANTITY: 1
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
OVERALL DIAMETER0.492 INCHES MINIMUM AND 0.500 INCHES MAXIMUM IN
SURFACE FINISHFINE GROUND ONE SIDE AND POLISHED WITH RIM AND CHAMFERS GROUND OTHER SIDE
OVERALL THICKNESS0.100 INCHES MINIMUM AND 0.110 INCHES MAXIMUM IN
MATERIAL TRANSPARENCYCLEAR
STYLE DESIGNATORCIRCULAR
MATERIAL DOCUMENT AND CLASSIFICATIONDD-G-451 FED SPEC SINGLE MATERIAL RESPONSE
EDGE TYPEBEVELED
PLY QUANTITY1
SPECIAL FEATURESBOTH EDGES CHAMFERED 0.005 IN. TO @O.020 IN. AT 45 DEG IN
MATERIALGLASS
SUBSTITUTES & CROSS-REFERENCES 2
5340005418243Reference document
Same NSN cross-reference
Reference document — Informative reference only
9340005418243Reference document
Same NSN cross-reference
Reference document — Informative reference only
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Normally procured from the manufacturer (OEM)No demilitarization required
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FREQUENTLY ASKED QUESTIONS
What is 8200-034?
8200-034 is a MICROCIRCUIT,MEMORY.
What parts can replace 8200-034?
There are 2 known substitutes for 8200-034: 5340005418243, 9340005418243. Substitute compatibility should be verified for your specific system.
What is the NSN for 8200-034?
8200-034 is cataloged in the U.S. Government catalog under NSN 9340-00-541-8243. This indicates validated use in U.S. government and defense supply chains.
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