8103507SB — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

8103507SB: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN, body_height: 0.045 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN, body_length: 0.540 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND BIPOLAR AND PROGRAMMABLE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-262-9878, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

8103507SB

NSN: 5962-01-262-9878
FSC: 5962 — Microcircuits, Electronic
CAGE: 67268 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (STANDARD MICROCIRCUIT (USA)

SPECIFICATIONS

body_width	0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN
body_height	0.045 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN
body_length	0.540 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND BIPOLAR AND PROGRAMMABLE
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	PAL
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	12 INPUT
inclosure_configuration	FLAT PACK
NSN	5962-01-262-9878

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 12 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.045 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND BIPOLAR AND PROGRAMMABLE

•

INCLOSURE CONFIGURATION: FLAT PACK

•

CURRENT RATING PER CHARACTERISTIC: 100.00 MILLIAMPERES NOMINAL OUTPUT

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	12 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN
BODY HEIGHT	0.045 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND BIPOLAR AND PROGRAMMABLE
INCLOSURE CONFIGURATION	FLAT PACK
CURRENT RATING PER CHARACTERISTIC	100.00 MILLIAMPERES NOMINAL OUTPUT
MEMORY DEVICE TYPE	PAL
BODY LENGTH	0.540 INCHES MAXIMUM IN

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 7

8103507SASame NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

PAL12L6MW/883Reference document

Same NSN cross-reference

Reference document — Secondary reference

5962-8103507BSAReference document

Same NSN cross-reference

Reference document — Secondary reference

5962-8103507BSBReference document

Same NSN cross-reference

Reference document — Secondary reference

5962-8103507BSXReference document

Same NSN cross-reference

Reference document — Secondary reference

81035Reference document

Same NSN cross-reference

Reference document — Identification reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandNo demilitarization required

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FREQUENTLY ASKED QUESTIONS

What is 8103507SB?

8103507SB is a MICROCIRCUIT,MEMORY.

What parts can replace 8103507SB?

There are 7 known substitutes for 8103507SB: 8103507SA, PAL12L6MW/883, 5962-8103507BSA and 4 more. Substitute compatibility should be verified for your specific system.

What is the NSN for 8103507SB?

8103507SB is cataloged in the U.S. Government catalog under NSN 5962-01-262-9878. This indicates validated use in U.S. government and defense supply chains.

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