Name: MICROCIRCUIT,MEMORY
Brand: Unknown
SKU: 8103506RX

8103506RX ✓ Verified by PartsTable

— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES NOMINAL IN, body_length: 1.080 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND PROGRAMMABLE AND BIPOLAR AND SCHOTTKY, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-162-8306, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

8103506RX

NSN: 5962-01-162-8306
FSC: 5962
CAGE: 67268 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (STANDARD MICROCIRCUIT (USA)

SPECIFICATIONS

body_width	0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height	0.185 INCHES NOMINAL IN
body_length	1.080 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND PROGRAMMABLE AND BIPOLAR AND SCHOTTKY
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	PAL
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	10 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-162-8306

COMPONENT DIAGRAM

KEY FEATURES

•

VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.5 VOLTS MAXIMUM POWER SOURCE

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FEATURES PROVIDED: HERMETICALLY SEALED AND PROGRAMMABLE AND BIPOLAR AND SCHOTTKY

•

INPUT CIRCUIT PATTERN: 10 INPUT

•

BODY WIDTH: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN

•

OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC

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MEMORY DEVICE TYPE: PAL

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INCLOSURE MATERIAL: CERAMIC

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TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS (FLIS)

VOLTAGE RATING AND TYPE PER CHARACTERISTIC	5.5 VOLTS MAXIMUM POWER SOURCE
FEATURES PROVIDED	HERMETICALLY SEALED AND PROGRAMMABLE AND BIPOLAR AND SCHOTTKY
INPUT CIRCUIT PATTERN	10 INPUT
BODY WIDTH	0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
OUTPUT LOGIC FORM	TRANSISTOR-TRANSISTOR LOGIC
MEMORY DEVICE TYPE	PAL
INCLOSURE MATERIAL	CERAMIC
TEST DATA DOCUMENT	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
CURRENT RATING PER CHARACTERISTIC	100.00 MILLIAMPERES NOMINAL OUTPUT
TERMINAL SURFACE TREATMENT	SOLDER

VERIFIED SUBSTITUTES & CROSS-REFERENCES 13

PAL10L8Interchangeable