The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include color: TAN, material: PLASTIC URETHANE, physical_form: PASTE, features_provided: SEPARATE CATALYST, specific_usage_design: FOR BONDING ALUMINUM AND PLASTIC SUBSTRATES, supplementary_features: 2 POUNDS RESIN AND 0.81 POUNDS HARDENER LBS. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 8040-00-828-4936, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| color | TAN |
| material | PLASTIC URETHANE |
| physical_form | PASTE |
| special_features | HIGH STRENGTH; ROOM TEMPERATURE OR ELEVATED TEMPERATURE CURE MATERIAL SHALL BE STORED IN ORIGINAL SEALED CONTAINERS AT TEMPERATURES FROM 70-90 DEG F DEGF |
| features_provided | SEPARATE CATALYST |
| specific_usage_design | FOR BONDING ALUMINUM AND PLASTIC SUBSTRATES |
| supplementary_features | 2 POUNDS RESIN AND 0.81 POUNDS HARDENER LBS |
| NSN | 8040-00-828-4936 |
| SPECIFIC USAGE DESIGN | FOR BONDING ALUMINUM AND PLASTIC SUBSTRATES |
| PHYSICAL FORM | PASTE |
| MATERIAL | PLASTIC URETHANE |
| SUPPLEMENTARY FEATURES | 2 POUNDS RESIN AND 0.81 POUNDS HARDENER LBS |
| COLOR | TAN |
| FEATURES PROVIDED | SEPARATE CATALYST |
| SPECIAL FEATURES | HIGH STRENGTH; ROOM TEMPERATURE OR ELEVATED TEMPERATURE CURE MATERIAL SHALL BE STORED IN ORIGINAL SEALED CONTAINERS AT TEMPERATURES FROM 70-90 DEG F DEGF |