808823-1 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

808823-1: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.280 INCHES MINIMUM AND 0.305 INCHES MAXIMUM IN, body_height: 0.085 INCHES MINIMUM AND 0.115 INCHES MAXIMUM IN, body_length: 0.890 INCHES MINIMUM AND 0.910 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND STATIC OPERATION AND 3-STATE OUTPUT, output_logic_form: METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-206-9467, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

808823-1

NSN: 5962-01-206-9467
FSC: 5962 — Microcircuits, Electronic
CAGE: 96214 — RAYTHEON COMPANY DBA RAYTHEON (USA)

SPECIFICATIONS

body_width	0.280 INCHES MINIMUM AND 0.305 INCHES MAXIMUM IN
body_height	0.085 INCHES MINIMUM AND 0.115 INCHES MAXIMUM IN
body_length	0.890 INCHES MINIMUM AND 0.910 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND STATIC OPERATION AND 3-STATE OUTPUT
output_logic_form	METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC AND GLASS
memory_device_type	RAM
storage_temp_range	-55.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	15 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-206-9467

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 15 INPUT

•

INCLOSURE MATERIAL: CERAMIC AND GLASS

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.280 INCHES MINIMUM AND 0.305 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.085 INCHES MINIMUM AND 0.115 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND STATIC OPERATION AND 3-STATE OUTPUT

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: RAM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	15 INPUT
INCLOSURE MATERIAL	CERAMIC AND GLASS
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.280 INCHES MINIMUM AND 0.305 INCHES MAXIMUM IN
BODY HEIGHT	0.085 INCHES MINIMUM AND 0.115 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND STATIC OPERATION AND 3-STATE OUTPUT
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	RAM
BODY LENGTH	0.890 INCHES MINIMUM AND 0.910 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-55.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 3

899-134-120Reference document

Same NSN cross-reference

Reference document — Advisory reference — outside the item-of-supply concept

MD2114A-5/BReference document

Same NSN cross-reference

Reference document — Secondary reference

SMJ2114-25JDMSame NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 808823-1?

808823-1 is a MICROCIRCUIT,MEMORY.

What parts can replace 808823-1?

There are 3 known substitutes for 808823-1: 899-134-120, MD2114A-5/B, SMJ2114-25JDM. Substitute compatibility should be verified for your specific system.

What is the NSN for 808823-1?

808823-1 is cataloged in the U.S. Government catalog under NSN 5962-01-206-9467. This indicates validated use in U.S. government and defense supply chains.

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