The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN, body_length: 0.785 INCHES MAXIMUM IN, special_features: STAR-PAN TO MICRO-B USB 2.0 ADAPTER;DWV AT 60VDC AND INSULATION RESISTANCE AT 10 MEGOHMS MIN VDC, features_provided: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND POSITIVE OUTPUTS, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-282-7007, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| body_width | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN |
| body_height | 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN |
| body_length | 0.785 INCHES MAXIMUM IN |
| special_features | STAR-PAN TO MICRO-B USB 2.0 ADAPTER;DWV AT 60VDC AND INSULATION RESISTANCE AT 10 MEGOHMS MIN VDC |
| features_provided | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND POSITIVE OUTPUTS |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 175.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | QUAD 2 INPUT |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-01-282-7007 |
| DESIGN FUNCTION AND QUANTITY | 4 GATE, NAND |
| MAXIMUM POWER DISSIPATION RATING | 200.0 MILLIWATTS |
| BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND POSITIVE OUTPUTS |
| INCLOSURE MATERIAL | CERAMIC |
| INPUT CIRCUIT PATTERN | QUAD 2 INPUT |
| SPECIFICATION/STANDARD DATA | 81349-MIL-M-38510/50 GOVERNMENT SPECIFICATION |
| TERMINAL SURFACE TREATMENT | SOLDER |
| STORAGE TEMP RANGE | -65.0 TO 175.0 CELSIUS DEGC |
| BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN |