8080-1G17: SOCKET,PLUG-IN ELECTRONIC COMPON.
SOCKET,PLUG-IN ELECTRONIC COMPON. Key specifications include material: COPPER ALLOY CONTACT, body_style: WAFER TYPE, overall_length: 1.670 INCHES NOMINAL IN, precious_material: GOLD, surface_treatment: GOLD CONTACT, terminal_type_and_quantity: 2 SOLDER STUD. This part is cataloged in the U.S.
Government catalog under NSN 5935-01-377-3611, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | COPPER ALLOY CONTACT |
| body_style | WAFER TYPE |
| overall_length | 1.670 INCHES NOMINAL IN |
| precious_material | GOLD |
| surface_treatment | GOLD CONTACT |
| terminal_type_and_quantity | 2 SOLDER STUD |
| precious_material_and_weight | 0.010 GOLD GRAINS, TROY |
| accommodated_contact_quantity | 2 |
| precious_material_and_location | CONTACT SURFACTS GOLD |
| contact_position_arrangement_style | IN LINE |
| contact_maximum_current_rating_in_amps | 10.0 |
| NSN | 5935-01-377-3611 |
| CONTACT MAXIMUM CURRENT RATING IN AMPS | 10.0 |
| BODY STYLE | WAFER TYPE |
| ACCOMMODATED CONTACT QUANTITY | 2 |
| PRECIOUS MATERIAL | GOLD |
| PRECIOUS MATERIAL AND WEIGHT | 0.010 GOLD GRAINS, TROY |
| OVERALL LENGTH | 1.670 INCHES NOMINAL IN |
| CONTACT POSITION ARRANGEMENT STYLE | IN LINE |
| SURFACE TREATMENT | GOLD CONTACT |
| MOUNTING TYPE FOR WHICH DESIGNED | PRINTED CIRCUIT |
| PRECIOUS MATERIAL AND LOCATION | CONTACT SURFACTS GOLD |
No substitute or cross-reference records for this part.