The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.302 INCHES MAXIMUM IN, body_height: 0.145 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN, body_length: 0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND HERMETICALLY SEALED AND PROGRAMMABLE, output_logic_form: EMITTER-COUPLED LOGIC, inclosure_material: CERAMIC. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-149-9474, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| body_width | 0.302 INCHES MAXIMUM IN |
| body_height | 0.145 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN |
| body_length | 0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN |
| features_provided | MONOLITHIC AND HERMETICALLY SEALED AND PROGRAMMABLE |
| output_logic_form | EMITTER-COUPLED LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | ROM |
| storage_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| operating_temp_range | -30.0 TO 85.0 CELSIUS DEGC |
| input_circuit_pattern | 10 INPUT |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-01-149-9474 |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| BODY WIDTH | 0.302 INCHES MAXIMUM IN |
| OUTPUT LOGIC FORM | EMITTER-COUPLED LOGIC |
| MAXIMUM POWER DISSIPATION RATING | 675.8 MILLIWATTS |
| FEATURES PROVIDED | MONOLITHIC AND HERMETICALLY SEALED AND PROGRAMMABLE |
| MEMORY DEVICE TYPE | ROM |
| TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
| TIME RATING PER CHACTERISTIC | 20.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT NS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |