807046-1 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

807046-1: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.265 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN, body_height: 0.175 INCHES MAXIMUM IN, body_length: 0.990 INCHES MINIMUM AND 0.995 INCHES MAXIMUM IN, features_provided: PROGRAMMED AND HERMETICALLY SEALED, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-189-1031, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

807046-1

NSN: 5962-01-189-1031
FSC: 5962 — Microcircuits, Electronic
CAGE: 96214 — RAYTHEON COMPANY DBA RAYTHEON (USA)

SPECIFICATIONS

body_width	0.265 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN
body_height	0.175 INCHES MAXIMUM IN
body_length	0.990 INCHES MINIMUM AND 0.995 INCHES MAXIMUM IN
features_provided	PROGRAMMED AND HERMETICALLY SEALED
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	PAL
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	16 INPUT
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
NSN	5962-01-189-1031

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 16 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.265 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.175 INCHES MAXIMUM IN

•

FEATURES PROVIDED: PROGRAMMED AND HERMETICALLY SEALED

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: PAL

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	16 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.265 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN
BODY HEIGHT	0.175 INCHES MAXIMUM IN
FEATURES PROVIDED	PROGRAMMED AND HERMETICALLY SEALED
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	PAL
BODY LENGTH	0.990 INCHES MINIMUM AND 0.995 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 2

PAL16R8MJ/883BReference document

Same NSN cross-reference

Reference document — Secondary reference

ROM/PROM FAMILY 048Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is 807046-1?

807046-1 is a MICROCIRCUIT,MEMORY.

What parts can replace 807046-1?

There are 2 known substitutes for 807046-1: PAL16R8MJ/883B, ROM/PROM FAMILY 048. Substitute compatibility should be verified for your specific system.

What is the NSN for 807046-1?

807046-1 is cataloged in the U.S. Government catalog under NSN 5962-01-189-1031. This indicates validated use in U.S. government and defense supply chains.

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