The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.265 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN, body_height: 0.175 INCHES MAXIMUM IN, body_length: 0.990 INCHES MINIMUM AND 0.995 INCHES MAXIMUM IN, features_provided: PROGRAMMED AND HERMETICALLY SEALED, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-189-1031, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.265 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN |
| body_height | 0.175 INCHES MAXIMUM IN |
| body_length | 0.990 INCHES MINIMUM AND 0.995 INCHES MAXIMUM IN |
| features_provided | PROGRAMMED AND HERMETICALLY SEALED |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | PAL |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 16 INPUT |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-01-189-1031 |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| PART NAME ASSIGNED BY CONTROLLING AGENCY | ARRAY,LOGIC |
| BODY WIDTH | 0.265 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN |
| TERMINAL TYPE AND QUANTITY | 20 PRINTED CIRCUIT |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| BODY HEIGHT | 0.175 INCHES MAXIMUM IN |
| TERMINAL SURFACE TREATMENT | SOLDER |
| MEMORY DEVICE TYPE | PAL |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 12.0 VOLTS MAXIMUM POWER SOURCE |