The INSULATING COMPOUND,ELECTRICAL is a the manufacturer industrial component. Key specifications include material: SILICONE, physical_form: PASTE, special_features: THIXOTROPIC PASTE; NON-CORROSIVE STORAGE: STORE AT 60 DEGREES TO 80 DEGREES., specific_usage_design: FOR HIGH STRENGTH BONDING OF SENSITIVE METALS AND ELECTRONIC EQUIPMENT, supplementary_features: 2.8 OUNCE IN 3 OUNCE TUBE OZ, nondefinitive_spec/std_data: 2 GROUP AND 1 TYPE. This part is cataloged in the Federal Logistics Information System under NSN 8040-01-394-3735, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| material | SILICONE |
| physical_form | PASTE |
| special_features | THIXOTROPIC PASTE; NON-CORROSIVE STORAGE: STORE AT 60 DEGREES TO 80 DEGREES. |
| specific_usage_design | FOR HIGH STRENGTH BONDING OF SENSITIVE METALS AND ELECTRONIC EQUIPMENT |
| supplementary_features | 2.8 OUNCE IN 3 OUNCE TUBE OZ |
| nondefinitive_spec/std_data | 2 GROUP AND 1 TYPE |
| quantity_within_each_unit_package | 2.800 OUNCES OZ |
| NSN | 8040-01-394-3735 |
| SPECIAL FEATURES | THIXOTROPIC PASTE; NON-CORROSIVE STORAGE: STORE AT 60 DEGREES TO 80 DEGREES. |
| COLOR | CLEAR |
| SUPPLEMENTARY FEATURES | 2.8 OUNCE IN 3 OUNCE TUBE OZ |
| NONDEFINITIVE SPEC/STD DATA | 2 GROUP AND 1 TYPE |
| MATERIAL | SILICONE |
| PHYSICAL FORM | PASTE |
| QUANTITY WITHIN EACH UNIT PACKAGE | 2.800 OUNCES OZ |
| SPECIFIC USAGE DESIGN | FOR HIGH STRENGTH BONDING OF SENSITIVE METALS AND ELECTRONIC EQUIPMENT |