The Adhesive, cataloged under National Stock Number 8040-01-145-1053, is classified within Federal Supply Class 8040 (No Item Name Available) of the Brushes, Paints, Sealers, and Adhesives group. The primary manufacturer of record is Epoxy Technology Inc Dba Epoxy Technology Inc. Government technical data includes 2 verified specifications, sourced from the Federal Logistics Information System (FLIS). This item has 1 commercial cross-reference from 1 manufacturer, enabling identification through both NSN and commercial part number lookups. 8 verified substitutes exist in the FLIS interchangeability database. Current acquisition status: Active.
| Parameter | Value |
|---|---|
| NSN | 8040-01-145-1053 |
| Primary Part Number | H40 |
| Item Name | Adhesive |
| FSC / FSG | 8040 / 80 — No Item Name Available |
| Manufacturer | Epoxy Technology Inc Dba Epoxy Technology Inc |
| Status | ACTIVE |
| Specific Usage Design | BONDING SEMICONDUCTOR CHIPS IN THE FABRICATION OF HYBRID CIRCUITS; DIE ATTACHING MOS CHIPS |
| Physical Form | PASTE |
| Acquisition Status | ACTIVE |
| HAZMAT | No |
| Part Number | Manufacturer |
|---|---|
| H40 PRIMARY | Epoxy Technology Inc Dba Epoxy Technology Inc (USA) |
NSN 8040-01-145-1053 is a Adhesive, manufactured by Epoxy Technology Inc Dba Epoxy Technology Inc, classified under FSC 8040 (No Item Name Available). Status: active.
NSN 8040-01-145-1053 has 1 cross-referenced part number: H40 (Epoxy Technology Inc Dba Epoxy Technology Inc).
There are 8 known substitutes for 8040-01-145-1053: 3110-00-044-4869, 3411-00-497-2899, 3110-00-555-5423 and 5 more. Verify interchangeability with system specifications before substitution.
Key specifications for H40: Specific Usage Design: BONDING SEMICONDUCTOR CHIPS IN THE FABRICATION OF HYBRID CIRCUITS; DIE ATTACHING MOS CHIPS; Physical Form: PASTE. 2 total characteristics are documented in the Federal Logistics Information System.