80018: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.245 INCHES MINIMUM AND 0.285 INCHES MAXIMUM IN, body_height: 0.045 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN, body_length: 0.440 INCHES MAXIMUM IN, features_provided: LOW POWER AND SCHOTTKY AND SYNCHRONOUS, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.
Government catalog under NSN 5905-00-422-4652, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.245 INCHES MINIMUM AND 0.285 INCHES MAXIMUM IN |
| body_height | 0.045 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN |
| body_length | 0.440 INCHES MAXIMUM IN |
| features_provided | LOW POWER AND SCHOTTKY AND SYNCHRONOUS |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 9 INPUT |
| inclosure_configuration | FLAT PACK |
| terminal_surface_treatment | SOLDER |
| NSN | 5905-00-422-4652 |
| ASSEMBLY CONSTRUCTION METHOD | LEADS SOLDERED TO TERMINALS |
No substitute or cross-reference records for this part.