8001208JB — MICROCIRCUIT,DIGITAL

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

8001208JB: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.610 INCHES MAXIMUM IN, body_height: 0.150 INCHES MAXIMUM IN, body_length: 1.290 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-322-5937, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

8001208JB

NSN: 5962-01-322-5937
FSC: 5962 — Microcircuits, Electronic
CAGE: 67268 — DLA LAND AND MARITIME DBA ENGINEERING AND TECHNICAL SUPPORT DIV DOCUMENT STANDARDIZATION DIVISION (STANDARD MICROCIRCUIT (USA)

SPECIFICATIONS

body_width	0.610 INCHES MAXIMUM IN
body_height	0.150 INCHES MAXIMUM IN
body_length	1.290 INCHES MAXIMUM IN
features_provided	MONOLITHIC AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE
output_logic_form	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	14 INPUT
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-322-5937

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 14 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.610 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.150 INCHES MAXIMUM IN

•

FEATURES PROVIDED: MONOLITHIC AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	14 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.610 INCHES MAXIMUM IN
BODY HEIGHT	0.150 INCHES MAXIMUM IN
FEATURES PROVIDED	MONOLITHIC AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	1.290 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 5

AM2732B-200/BJAReference document

Same NSN cross-reference

Reference document — Secondary reference

80012Reference document

Same NSN cross-reference

Reference document — Identification reference

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

8001208JXReference document

Same NSN cross-reference

Reference document — Secondary reference

8001208JASame NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 8001208JB?

8001208JB is a MICROCIRCUIT,DIGITAL.

What parts can replace 8001208JB?

There are 5 known substitutes for 8001208JB: AM2732B-200/BJA, 80012, ROM/PROM and 2 more. Substitute compatibility should be verified for your specific system.

What is the NSN for 8001208JB?

8001208JB is cataloged in the U.S. Government catalog under NSN 5962-01-322-5937. This indicates validated use in U.S. government and defense supply chains.

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8001208JB — MICROCIRCUIT,DIGITAL

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