The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: GLASS ENCLOSURE, overall_length: 0.180 INCHES MAXIMUM IN, mounting_method: TERMINAL, overall_diameter: 0.075 INCHES MAXIMUM IN, special_features: WEIGHT:1.261 LBS LBS, features_provided: GOLD PLATED LEADS AND HERMETICALLY SEALED CASE. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 2815-00-213-0543, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | GLASS ENCLOSURE |
| overall_length | 0.180 INCHES MAXIMUM IN |
| mounting_method | TERMINAL |
| overall_diameter | 0.075 INCHES MAXIMUM IN |
| special_features | WEIGHT:1.261 LBS LBS |
| features_provided | GOLD PLATED LEADS AND HERMETICALLY SEALED CASE |
| end_item_identification | GEAR BOX MAIN REDUCTION, 23088199 |
| terminal_type_and_quantity | 2 UNINSULATED WIRE LEAD |
| power_rating_per_characteristic | 500.000 MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION |
| current_rating_per_characteristic | 20.000 MICROAMPERES MAXIMUM REVERSE CURRENT, DC |
| part_name_assigned_by_controlling_agency | GEAR DOUBLE HELICAL ASSEMBLY |
| voltage_rating_in_volts_per_characteristic | 1.2 MAXIMUM ON VOLTAGE, FORWARD VOLTAGE DROP, DC |
| NSN | 2815-00-213-0543 |