79931055-001 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

79931055-001: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include features_provided: BIPOLAR AND PROGRAMMED, output_logic_form: BIPOLAR METAL-OXIDE SEMICONDUCTOR, inclosure_material: CERAMIC, memory_device_type: PAL, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-372-9625, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

79931055-001

NSN: 5962-01-372-9625
FSC: 5962 — Microcircuits, Electronic
CAGE: 04939 — LOCKHEED MARTIN CORPORATION (USA)

SPECIFICATIONS

features_provided	BIPOLAR AND PROGRAMMED
output_logic_form	BIPOLAR METAL-OXIDE SEMICONDUCTOR
inclosure_material	CERAMIC
memory_device_type	PAL
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	20 INPUT
hybrid_technology_type	MONOLITHIC
inclosure_configuration	LEADLESS FLAT PACK
terminal_surface_treatment	SOLDER
specification/standard_data	67268-5962-87671013A GOVERNMENT STANDARD A
departure_from_cited_designator	ALTERED BY PROGRAMMING & MARKING
NSN	5962-01-372-9625

COMPONENT DIAGRAM

KEY FEATURES

•

HYBRID TECHNOLOGY TYPE: MONOLITHIC

•

INPUT CIRCUIT PATTERN: 20 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

FEATURES PROVIDED: BIPOLAR AND PROGRAMMED

•

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK

•

PURCHASE DESCRIPTION IDENTIFICATION: 04939-79931055-001

•

CURRENT RATING PER CHARACTERISTIC: 100.00 MILLIAMPERES MAXIMUM OUTPUT SINK

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

HYBRID TECHNOLOGY TYPE	MONOLITHIC
INPUT CIRCUIT PATTERN	20 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
FEATURES PROVIDED	BIPOLAR AND PROGRAMMED
INCLOSURE CONFIGURATION	LEADLESS FLAT PACK
PURCHASE DESCRIPTION IDENTIFICATION	04939-79931055-001
CURRENT RATING PER CHARACTERISTIC	100.00 MILLIAMPERES MAXIMUM OUTPUT SINK
MEMORY DEVICE TYPE	PAL
DEPARTURE FROM CITED DESIGNATOR	ALTERED BY PROGRAMMING & MARKING

SUBSTITUTES & CROSS-REFERENCES 2

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

5962-87671013AReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 79931055-001?

79931055-001 is a MICROCIRCUIT,MEMORY.

What parts can replace 79931055-001?

There are 2 known substitutes for 79931055-001: ROM/PROM, 5962-87671013A. Substitute compatibility should be verified for your specific system.

What is the NSN for 79931055-001?

79931055-001 is cataloged in the U.S. Government catalog under NSN 5962-01-372-9625. This indicates validated use in U.S. government and defense supply chains.

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