The SEMICONDUCTOR DEVICES,UNITIZED is a the manufacturer industrial component. Key specifications include material: PLASTIC ENCLOSURE, overall_width: 0.260 INCHES MAXIMUM IN, overall_height: 0.150 INCHES MAXIMUM IN, overall_length: 0.770 INCHES MAXIMUM IN, mounting_method: TERMINAL, terminal_length: 0.200 INCHES MAXIMUM IN. This part is cataloged in the Federal Logistics Information System under NSN 5961-01-260-3866, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| material | PLASTIC ENCLOSURE |
| overall_width | 0.260 INCHES MAXIMUM IN |
| overall_height | 0.150 INCHES MAXIMUM IN |
| overall_length | 0.770 INCHES MAXIMUM IN |
| mounting_method | TERMINAL |
| terminal_length | 0.200 INCHES MAXIMUM IN |
| special_features | ALL TRANSISTOR JUNCTION PATTERN ARRANGEMENT: NPN |
| semiconductor_material | SILICON ALL TRANSISTOR |
| terminal_type_and_quantity | 14 PIN |
| component_name_and_quantity | 4 TRANSISTOR |
| power_rating_per_characteristic | 300.0 MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION ALL TRANSISTOR |
| current_rating_per_characteristic | 40.00 MILLIAMPERES MAXIMUM COLLECTOR CUTOFF CURRENT, DC, EMITTER OPEN ALL TRANSISTOR |
| NSN | 5961-01-260-3866 |
| POWER RATING PER CHARACTERISTIC | 300.0 MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION ALL TRANSISTOR |
| SPECIAL FEATURES | ALL TRANSISTOR JUNCTION PATTERN ARRANGEMENT: NPN |
| MOUNTING METHOD | TERMINAL |
| TERMINAL LENGTH | 0.200 INCHES MAXIMUM IN |
| OVERALL WIDTH | 0.260 INCHES MAXIMUM IN |
| OVERALL HEIGHT | 0.150 INCHES MAXIMUM IN |
| MATERIAL | PLASTIC ENCLOSURE |
| TERMINAL TYPE AND QUANTITY | 14 PIN |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 125.0 CELSIUS JUNCTION DEGC |
| OVERALL LENGTH | 0.770 INCHES MAXIMUM IN |