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7849976P001 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

7849976P001: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 0.840 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: HERMETICALLY SEALED AND BIPOLAR AND PROGRAMMABLE AND BURN IN AND W/ENABLE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-160-4902, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
7849976P001
NSN: 5962-01-160-4902
FSC: 5962 — Microcircuits, Electronic
CAGE: 03538 — LOCKHEED MARTIN CORPORATION DIV RMS (USA)
SPECIFICATIONS
body_width0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height0.185 INCHES MAXIMUM IN
body_length0.840 INCHES MAXIMUM IN
memory_capacityUNKNOWN
features_providedHERMETICALLY SEALED AND BIPOLAR AND PROGRAMMABLE AND BURN IN AND W/ENABLE
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern6 INPUT
NSN5962-01-160-4902
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 7849976P001 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 6 INPUT
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.185 INCHES MAXIMUM IN
•
FEATURES PROVIDED: HERMETICALLY SEALED AND BIPOLAR AND PROGRAMMABLE AND BURN IN AND W/ENABLE
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
MEMORY DEVICE TYPE: ROM
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN6 INPUT
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
BODY HEIGHT0.185 INCHES MAXIMUM IN
FEATURES PROVIDEDHERMETICALLY SEALED AND BIPOLAR AND PROGRAMMABLE AND BURN IN AND W/ENABLE
INCLOSURE CONFIGURATIONDUAL-IN-LINE
MEMORY DEVICE TYPEROM
CASE OUTLINE SOURCE AND DESIGNATORD-2 MIL-M-38510
BODY LENGTH0.840 INCHES MAXIMUM IN
SUBSTITUTES & CROSS-REFERENCES 3
ROM/PROM FAMILY 013Reference document
Same NSN cross-reference
Reference document — Secondary reference
JBP18S030MJReference document
Same NSN cross-reference
Reference document — Secondary reference
7849879Reference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Terminal item — no further procurement; issued until stock is exhaustedDemilitarization required — critical (Q)
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FREQUENTLY ASKED QUESTIONS
What is 7849976P001?
7849976P001 is a MICROCIRCUIT,MEMORY.
What parts can replace 7849976P001?
There are 3 known substitutes for 7849976P001: ROM/PROM FAMILY 013, JBP18S030MJ, 7849879. Substitute compatibility should be verified for your specific system.
What is the NSN for 7849976P001?
7849976P001 is cataloged in the U.S. Government catalog under NSN 5962-01-160-4902. This indicates validated use in U.S. government and defense supply chains.
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