The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN, body_height: 0.045 INCHES MINIMUM AND 0.092 INCHES MAXIMUM IN, body_length: 0.540 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND LOW POWER AND 3-STATE OUTPUT AND SCHOTTKY, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-241-8630, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN |
| body_height | 0.045 INCHES MINIMUM AND 0.092 INCHES MAXIMUM IN |
| body_length | 0.540 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED AND BURN IN AND LOW POWER AND 3-STATE OUTPUT AND SCHOTTKY |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 10 INPUT |
| inclosure_configuration | FLAT PACK |
| terminal_surface_treatment | SOLDER |
| terminal_type_and_quantity | 16 PRINTED CIRCUIT |
| NSN | 5962-01-241-8630 |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| CASE OUTLINE SOURCE AND DESIGNATOR | F-9 MIL-M-38510 |
| INPUT CIRCUIT PATTERN | 10 INPUT |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| INCLOSURE CONFIGURATION | FLAT PACK |
| TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
| BODY WIDTH | 0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN |
| DESIGN FUNCTION AND QUANTITY | 8 BUFFER AND 2 DRIVER, LINE |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |