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Technical Data Sheet
77-084668-08 ✓ Verified by PartsTable
· COMPONENT
WHAT YOU NEED TO KNOW
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PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include features_provided: PROGRAMMED AND ELECTROSTATIC SENSITIVE AND W/ENABLE, inclosure_material: CERAMIC, memory_device_type: PROM, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC, inclosure_configuration: DUAL-IN-LINE. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-265-3535, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
77-084668-08
NSN: 5962-01-265-3535
FSC: 5962
CAGE: 15280 — NORTHROP GRUMMAN SYSTEMS CORPORATION DIV ES DEFENSIVE SYSTEMS DIVISION (USA)
SPECIFICATIONS
features_providedPROGRAMMED AND ELECTROSTATIC SENSITIVE AND W/ENABLE
inclosure_materialCERAMIC
memory_device_typePROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
inclosure_configurationDUAL-IN-LINE
terminal_surface_treatmentSOLDER
terminal_type_and_quantity18 PRINTED CIRCUIT
voltage_rating_and_type_per_characteristic7.0 VOLTS MAXIMUM POWER SOURCE
NSN5962-01-265-3535
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 77-084668-08 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
FEATURES PROVIDED: PROGRAMMED AND ELECTROSTATIC SENSITIVE AND W/ENABLE
OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC
MEMORY DEVICE TYPE: PROM
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS MAXIMUM POWER SOURCE
TERMINAL TYPE AND QUANTITY: 18 PRINTED CIRCUIT
TERMINAL SURFACE TREATMENT: SOLDER
INCLOSURE CONFIGURATION: DUAL-IN-LINE
INCLOSURE MATERIAL: CERAMIC
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
FEATURES PROVIDEDPROGRAMMED AND ELECTROSTATIC SENSITIVE AND W/ENABLE
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
MEMORY DEVICE TYPEPROM
VOLTAGE RATING AND TYPE PER CHARACTERISTIC7.0 VOLTS MAXIMUM POWER SOURCE
TERMINAL TYPE AND QUANTITY18 PRINTED CIRCUIT
TERMINAL SURFACE TREATMENTSOLDER
INCLOSURE CONFIGURATIONDUAL-IN-LINE
INCLOSURE MATERIALCERAMIC
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
VERIFIED SUBSTITUTES & CROSS-REFERENCES 2
ROM/PROM FAMILY 007Interchangeable
Same NIIN cross-reference
interchangeable
82S185/BVAInterchangeable
Same NIIN cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 77-084668-08?
77-084668-08 is a MICROCIRCUIT,MEMORY.
What parts can replace 77-084668-08?
There are 2 known substitutes for 77-084668-08: ROM/PROM FAMILY 007, 82S185/BVA. Substitute compatibility should be verified for your specific system.
What is the NSN for 77-084668-08?
77-084668-08 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-265-3535. This indicates validated use in U.S. government and defense supply chains.
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