7606-0822 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

7606-0822: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.545 INCHES MAXIMUM IN, body_height: 0.100 INCHES MAXIMUM IN, body_length: 1.285 INCHES MAXIMUM IN, features_provided: BURN IN AND PROGRAMMED, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-166-3806, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

7606-0822

NSN: 5962-01-166-3806
FSC: 5962 — Microcircuits, Electronic
CAGE: 59475 — REX SYSTEMS INCORPORATED DBA REX SYSTEMS INC (USA)

SPECIFICATIONS

body_width	0.545 INCHES MAXIMUM IN
body_height	0.100 INCHES MAXIMUM IN
body_length	1.285 INCHES MAXIMUM IN
features_provided	BURN IN AND PROGRAMMED
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-55.0 TO 150.0 CELSIUS DEGC
operating_temp_range	+0.0 TO 75.0 CELSIUS DEGC
inclosure_configuration	FLAT PACK
terminal_surface_treatment	SOLDER
terminal_type_and_quantity	24 FLAT LEADS
NSN	5962-01-166-3806

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.545 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.100 INCHES MAXIMUM IN

•

FEATURES PROVIDED: BURN IN AND PROGRAMMED

•

INCLOSURE CONFIGURATION: FLAT PACK

•

MEMORY DEVICE TYPE: ROM

•

BODY LENGTH: 1.285 INCHES MAXIMUM IN

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.545 INCHES MAXIMUM IN
BODY HEIGHT	0.100 INCHES MAXIMUM IN
FEATURES PROVIDED	BURN IN AND PROGRAMMED
INCLOSURE CONFIGURATION	FLAT PACK
MEMORY DEVICE TYPE	ROM
BODY LENGTH	1.285 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-55.0 TO 150.0 CELSIUS DEGC
OUTPUT LOGIC FORM	TRANSISTOR-TRANSISTOR LOGIC

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 2

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

7606-0822-1Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

Ready to buy 7606-0822?

Compare prices from verified sellers on eBay

Buy on eBay →

As an eBay Partner, PartsTable may earn a commission. Your price is not affected.

FREQUENTLY ASKED QUESTIONS

What is 7606-0822?

7606-0822 is a MICROCIRCUIT,MEMORY.

What parts can replace 7606-0822?

There are 2 known substitutes for 7606-0822: ROM/PROM, 7606-0822-1. Substitute compatibility should be verified for your specific system.

What is the NSN for 7606-0822?

7606-0822 is cataloged in the U.S. Government catalog under NSN 5962-01-166-3806. This indicates validated use in U.S. government and defense supply chains.

Community Feedback

7606-0822 — MICROCIRCUIT,MEMORY

Request a Quote — 7606-0822