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75B049008-1001 — MICROCIRCUIT,DIGITAL

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

75B049008-1001: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include features_provided: PROGRAMMED, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC, memory_device_type: PROM, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-365-2255, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
75B049008-1001
NSN: 5962-01-365-2255
FSC: 5962 — Microcircuits, Electronic
CAGE: 76301 — THE BOEING COMPANY DIV DEFENSE (USA)
SPECIFICATIONS
features_providedPROGRAMMED
output_logic_formCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
memory_device_typePROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
hybrid_technology_typeMONOLITHIC
end_item_identificationLUG IN UNIT E/I FSCM 76301
inclosure_configurationDUAL-IN-LINE
terminal_surface_treatmentSOLDER
specification/standard_data96906-MIL-STD-883 GOVERNMENT STANDARD
time_rating_per_chacteristic50.00 NANOSECONDS NOMINAL ACCESS NS
NSN5962-01-365-2255
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,DIGITAL TITLE COMPONENT PN 75B049008-1001 MFR MICROCIRCUIT,DIGITAL
KEY FEATURES
•
HYBRID TECHNOLOGY TYPE: MONOLITHIC
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
FEATURES PROVIDED: PROGRAMMED
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
MEMORY DEVICE TYPE: PROM
•
CASE OUTLINE SOURCE AND DESIGNATOR: D-2 MIL-M-38510
•
SPECIFICATION/STANDARD DATA: 96906-MIL-STD-883 GOVERNMENT STANDARD
TECHNICAL CHARACTERISTICS
HYBRID TECHNOLOGY TYPEMONOLITHIC
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
FEATURES PROVIDEDPROGRAMMED
INCLOSURE CONFIGURATIONDUAL-IN-LINE
MEMORY DEVICE TYPEPROM
CASE OUTLINE SOURCE AND DESIGNATORD-2 MIL-M-38510
SPECIFICATION/STANDARD DATA96906-MIL-STD-883 GOVERNMENT STANDARD
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
OUTPUT LOGIC FORMCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
SUBSTITUTES & CROSS-REFERENCES 2
ROM/PROM FAMILY 186Reference document
Same NSN cross-reference
Reference document — Secondary reference
5962-8670301EAReference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation
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FREQUENTLY ASKED QUESTIONS
What is 75B049008-1001?
75B049008-1001 is a MICROCIRCUIT,DIGITAL.
What parts can replace 75B049008-1001?
There are 2 known substitutes for 75B049008-1001: ROM/PROM FAMILY 186, 5962-8670301EA. Substitute compatibility should be verified for your specific system.
What is the NSN for 75B049008-1001?
75B049008-1001 is cataloged in the U.S. Government catalog under NSN 5962-01-365-2255. This indicates validated use in U.S. government and defense supply chains.
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✓ PartsTable — the parts reference. Every fact cited to its source.
PartsTable Design LLC · partstable.com
U.S. Government catalog: edition PUBLOGDVD v12.0.0 (OCT 2026), edition date 2026-10-01, retrieved 2026-10-18.
PartsTable commercial catalog: edition Unified commercial catalog snapshot through 2026-09-28, edition date not on file, retrieved 2026-09-28.