75962013289105: MICROCIRCUIT,MEMORY.
The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.605 INCHES NOMINAL IN, body_length: 1.490 INCHES MAXIMUM IN, bit_quantity: 32768, features_provided: TESTED TO MIL-STD-883 AND 3-STATE OUTPUT AND MONOLITHIC, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-449-7410, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.605 INCHES NOMINAL IN |
| body_length | 1.490 INCHES MAXIMUM IN |
| bit_quantity | 32768 |
| features_provided | TESTED TO MIL-STD-883 AND 3-STATE OUTPUT AND MONOLITHIC |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | EEPROM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| body_outside_diameter | 0.232 INCHES MAXIMUM IN |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-01-449-7410 |
| BIT QUANTITY | 32768 |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY OUTSIDE DIAMETER | 0.232 INCHES MAXIMUM IN |
| BODY WIDTH | 0.605 INCHES NOMINAL IN |
| FEATURES PROVIDED | TESTED TO MIL-STD-883 AND 3-STATE OUTPUT AND MONOLITHIC |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CURRENT RATING PER CHARACTERISTIC | 100.00 MILLIAMPERES MAXIMUM SUPPLY |
| MEMORY DEVICE TYPE | EEPROM |
| BODY LENGTH | 1.490 INCHES MAXIMUM IN |