7573225-049: MICROCIRCUIT,MEMORY.
The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.300 INCHES MINIMUM AND 0.420 INCHES MAXIMUM IN, body_height: 0.045 INCHES MINIMUM AND 0.090 INCHES MAXIMUM IN, body_length: 0.640 INCHES MAXIMUM IN, features_provided: BURN IN AND ELECTROSTATIC SENSITIVE AND PROGRAMMED, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-353-8037, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.300 INCHES MINIMUM AND 0.420 INCHES MAXIMUM IN |
| body_height | 0.045 INCHES MINIMUM AND 0.090 INCHES MAXIMUM IN |
| body_length | 0.640 INCHES MAXIMUM IN |
| features_provided | BURN IN AND ELECTROSTATIC SENSITIVE AND PROGRAMMED |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | PROM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| inclosure_configuration | FLAT PACK |
| terminal_surface_treatment | SOLDER |
| terminal_type_and_quantity | 24 FLAT LEADS |
| NSN | 5962-01-353-8037 |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 0.300 INCHES MINIMUM AND 0.420 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.045 INCHES MINIMUM AND 0.090 INCHES MAXIMUM IN |
| FEATURES PROVIDED | BURN IN AND ELECTROSTATIC SENSITIVE AND PROGRAMMED |
| INCLOSURE CONFIGURATION | FLAT PACK |
| MEMORY DEVICE TYPE | PROM |
| CASE OUTLINE SOURCE AND DESIGNATOR | F-6 MIL-M-38510 |
| BODY LENGTH | 0.640 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |