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7573225-040 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

7573225-040: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.300 INCHES MINIMUM AND 0.420 INCHES MAXIMUM IN, body_height: 0.045 INCHES MINIMUM AND 0.090 INCHES MAXIMUM IN, body_length: 0.640 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND BIPOLAR, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-301-7007, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
7573225-040
NSN: 5962-01-301-7007
FSC: 5962 — Microcircuits, Electronic
CAGE: 13160 — GENERAL DYNAMICS LAND SYSTEMS INC. (USA)
SPECIFICATIONS
body_width0.300 INCHES MINIMUM AND 0.420 INCHES MAXIMUM IN
body_height0.045 INCHES MINIMUM AND 0.090 INCHES MAXIMUM IN
body_length0.640 INCHES MAXIMUM IN
memory_capacityUNKNOWN
features_providedELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND BIPOLAR
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern14 INPUT
NSN5962-01-301-7007
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 7573225-040 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 14 INPUT
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.300 INCHES MINIMUM AND 0.420 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.045 INCHES MINIMUM AND 0.090 INCHES MAXIMUM IN
•
FEATURES PROVIDED: ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND BIPOLAR
•
INCLOSURE CONFIGURATION: FLAT PACK
•
MEMORY DEVICE TYPE: ROM
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN14 INPUT
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.300 INCHES MINIMUM AND 0.420 INCHES MAXIMUM IN
BODY HEIGHT0.045 INCHES MINIMUM AND 0.090 INCHES MAXIMUM IN
FEATURES PROVIDEDELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND BIPOLAR
INCLOSURE CONFIGURATIONFLAT PACK
MEMORY DEVICE TYPEROM
CASE OUTLINE SOURCE AND DESIGNATORF-6 MIL-M-38510
BODY LENGTH0.640 INCHES MAXIMUM IN
SUBSTITUTES & CROSS-REFERENCES 3
ROM/PROMReference document
Same NSN cross-reference
Reference document — Secondary reference
7571894-205Reference document
Same NSN cross-reference
Reference document — Secondary reference
53S3281BW883BReference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Terminal item — no further procurement; issued until stock is exhaustedDemilitarization required — critical (Q)
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FREQUENTLY ASKED QUESTIONS
What is 7573225-040?
7573225-040 is a MICROCIRCUIT,MEMORY.
What parts can replace 7573225-040?
There are 3 known substitutes for 7573225-040: ROM/PROM, 7571894-205, 53S3281BW883B. Substitute compatibility should be verified for your specific system.
What is the NSN for 7573225-040?
7573225-040 is cataloged in the U.S. Government catalog under NSN 5962-01-301-7007. This indicates validated use in U.S. government and defense supply chains.
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