7566537-017 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

7566537-017: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.420 INCHES MAXIMUM IN, body_height: 0.090 INCHES MAXIMUM IN, body_length: 0.640 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND 3-STATE OUTPUT AND BIPOLAR AND ELECTROSTATIC SENSITIVE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-305-0469, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

7566537-017

NSN: 5962-01-305-0469
FSC: 5962 — Microcircuits, Electronic
CAGE: 13160 — GENERAL DYNAMICS LAND SYSTEMS INC. (USA)

SPECIFICATIONS

body_width	0.420 INCHES MAXIMUM IN
body_height	0.090 INCHES MAXIMUM IN
body_length	0.640 INCHES MAXIMUM IN
features_provided	MONOLITHIC AND 3-STATE OUTPUT AND BIPOLAR AND ELECTROSTATIC SENSITIVE
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	14 INPUT
inclosure_configuration	FLAT PACK
NSN	5962-01-305-0469

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 14 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.420 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.090 INCHES MAXIMUM IN

•

FEATURES PROVIDED: MONOLITHIC AND 3-STATE OUTPUT AND BIPOLAR AND ELECTROSTATIC SENSITIVE

•

INCLOSURE CONFIGURATION: FLAT PACK

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	14 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.420 INCHES MAXIMUM IN
BODY HEIGHT	0.090 INCHES MAXIMUM IN
FEATURES PROVIDED	MONOLITHIC AND 3-STATE OUTPUT AND BIPOLAR AND ELECTROSTATIC SENSITIVE
INCLOSURE CONFIGURATION	FLAT PACK
MEMORY DEVICE TYPE	ROM
CASE OUTLINE SOURCE AND DESIGNATOR	F-6 MIL-M-38510
BODY LENGTH	0.640 INCHES MAXIMUM IN

SUBSTITUTES & CROSS-REFERENCES 4

AM27PS191FMBReference document

Same NSN cross-reference

Reference document — Secondary reference

AM27PS191/BKAReference document

Same NSN cross-reference

Reference document — Secondary reference

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

29683AFMBReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 7566537-017?

7566537-017 is a MICROCIRCUIT,MEMORY.

What parts can replace 7566537-017?

There are 4 known substitutes for 7566537-017: AM27PS191FMB, AM27PS191/BKA, ROM/PROM and 1 more. Substitute compatibility should be verified for your specific system.

What is the NSN for 7566537-017?

7566537-017 is cataloged in the U.S. Government catalog under NSN 5962-01-305-0469. This indicates validated use in U.S. government and defense supply chains.

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7566537-017 — MICROCIRCUIT,MEMORY

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