7565701-013 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

7565701-013: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.360 INCHES MINIMUM AND 0.420 INCHES MAXIMUM IN, body_height: 0.045 INCHES MINIMUM AND 0.090 INCHES MAXIMUM IN, body_length: 0.640 INCHES MAXIMUM IN, features_provided: SCHOTTKY AND BIPOLAR AND PROGRAMMABLE AND MONOLITHIC, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC OR METAL. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-249-9744, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

7565701-013

NSN: 5962-01-249-9744
FSC: 5962 — Microcircuits, Electronic
CAGE: 13160 — GENERAL DYNAMICS LAND SYSTEMS INC. (USA)

SPECIFICATIONS

body_width	0.360 INCHES MINIMUM AND 0.420 INCHES MAXIMUM IN
body_height	0.045 INCHES MINIMUM AND 0.090 INCHES MAXIMUM IN
body_length	0.640 INCHES MAXIMUM IN
features_provided	SCHOTTKY AND BIPOLAR AND PROGRAMMABLE AND MONOLITHIC
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC OR METAL
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	14 INPUT
inclosure_configuration	FLAT PACK
NSN	5962-01-249-9744

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 14 INPUT

•

INCLOSURE MATERIAL: CERAMIC OR METAL

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.360 INCHES MINIMUM AND 0.420 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.045 INCHES MINIMUM AND 0.090 INCHES MAXIMUM IN

•

FEATURES PROVIDED: SCHOTTKY AND BIPOLAR AND PROGRAMMABLE AND MONOLITHIC

•

INCLOSURE CONFIGURATION: FLAT PACK

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	14 INPUT
INCLOSURE MATERIAL	CERAMIC OR METAL
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.360 INCHES MINIMUM AND 0.420 INCHES MAXIMUM IN
BODY HEIGHT	0.045 INCHES MINIMUM AND 0.090 INCHES MAXIMUM IN
FEATURES PROVIDED	SCHOTTKY AND BIPOLAR AND PROGRAMMABLE AND MONOLITHIC
INCLOSURE CONFIGURATION	FLAT PACK
MEMORY DEVICE TYPE	ROM
CASE OUTLINE SOURCE AND DESIGNATOR	F-6 MIL-M-38510
BODY LENGTH	0.640 INCHES MAXIMUM IN

SUBSTITUTES & CROSS-REFERENCES 1

ROM/PROM FAMILY 181Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is 7565701-013?

7565701-013 is a MICROCIRCUIT,MEMORY.

What parts can replace 7565701-013?

There is 1 known substitute for 7565701-013: ROM/PROM FAMILY 181. Substitute compatibility should be verified for your specific system.

What is the NSN for 7565701-013?

7565701-013 is cataloged in the U.S. Government catalog under NSN 5962-01-249-9744. This indicates validated use in U.S. government and defense supply chains.

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7565701-013 — MICROCIRCUIT,MEMORY

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