7555426P551 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

7555426P551: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include special_features: WEAPON SYSTEM ESSENTIAL, inclosure_material: CERAMIC, memory_device_type: ROM, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC, end_item_identification: E-2C HAWKEYE AIRCRAFT, inclosure_configuration: LEADLESS FLAT PACK. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-418-2493, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

7555426P551

NSN: 5962-01-418-2493
NIINs: 014182493, 014182494, 014182495, 014182498, 014182499, 014182501, 014182502
FSC: 5962 — Microcircuits, Electronic
CAGE: 99971 — LOCKHEED MARTIN CORP NAVAL ELECTRONICS & SURVEILLANCE SYSTEMS (USA)

SPECIFICATIONS

special_features	WEAPON SYSTEM ESSENTIAL
inclosure_material	CERAMIC
memory_device_type	ROM
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
end_item_identification	E-2C HAWKEYE AIRCRAFT
inclosure_configuration	LEADLESS FLAT PACK
terminal_surface_treatment	SOLDER
terminal_type_and_quantity	28 LEADLESS
time_rating_per_chacteristic	45.00 NANOSECONDS MAXIMUM ACCESS NS
criticality_code_justification	FEAT
part_name_assigned_by_controlling_agency	PROGRAMMED PROM
voltage_rating_and_type_per_characteristic	5.5 VOLTS NOMINAL POWER SOURCE
NSN	5962-01-418-2493

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK

•

MEMORY DEVICE TYPE: ROM

•

VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.5 VOLTS NOMINAL POWER SOURCE

•

OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC

•

TERMINAL TYPE AND QUANTITY: 28 LEADLESS

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
INCLOSURE CONFIGURATION	LEADLESS FLAT PACK
MEMORY DEVICE TYPE	ROM
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	5.5 VOLTS NOMINAL POWER SOURCE
OPERATING TEMP RANGE	-55.0 TO 125.0 CELSIUS DEGC
PART NAME ASSIGNED BY CONTROLLING AGENCY	PROGRAMMED PROM
TERMINAL TYPE AND QUANTITY	28 LEADLESS
TIME RATING PER CHACTERISTIC	45.00 NANOSECONDS MAXIMUM ACCESS NS

SUBSTITUTES & CROSS-REFERENCES 4

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

7503613G0004Reference document

Same NSN cross-reference

Reference document — Design control — primary reference

7503613G4Reference document

Same NSN cross-reference

Reference document — Secondary reference

CY7C261-45LMBReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is 7555426P551?

7555426P551 is a MICROCIRCUIT,MEMORY.

What parts can replace 7555426P551?

There are 4 known substitutes for 7555426P551: ROM/PROM, 7503613G0004, 7503613G4 and 1 more. Substitute compatibility should be verified for your specific system.

What is the NSN for 7555426P551?

7555426P551 is cataloged in the U.S. Government catalog under NSN 5962-01-418-2493. This indicates validated use in U.S. government and defense supply chains.

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7555426P551 — MICROCIRCUIT,MEMORY

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