The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include features_provided: HIGH SPEED AND MONOLITHIC, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC, test_data_document: 81349-MIL-STD-883/B STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)., operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-448-7877, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| features_provided | HIGH SPEED AND MONOLITHIC |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 81349-MIL-STD-883/B STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | QUAD 2 INPUT |
| inclosure_configuration | LEADLESS FLAT PACK |
| terminal_surface_treatment | SOLDER |
| terminal_type_and_quantity | 20 LEADLESS |
| design_function_and_quantity | 1 GATE, LOGIC |
| current_rating_per_characteristic | 4.00 MICROAMPERES MAXIMUM SUPPLY |
| NSN | 5962-01-448-7877 |
| PART NAME ASSIGNED BY CONTROLLING AGENCY | HC-CMOS |
| FEATURES PROVIDED | HIGH SPEED AND MONOLITHIC |
| TERMINAL TYPE AND QUANTITY | 20 LEADLESS |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.0 VOLTS NOMINAL INPUT |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| INCLOSURE MATERIAL | CERAMIC |
| CURRENT RATING PER CHARACTERISTIC | 4.00 MICROAMPERES MAXIMUM SUPPLY |
| DESIGN FUNCTION AND QUANTITY | 1 GATE, LOGIC |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |