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Technical Data Sheet
7537006P101 ✓ Verified by PartsTable
· COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.285 INCHES MAXIMUM IN, body_height: 0.085 INCHES MAXIMUM IN, body_length: 0.440 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND BIPOLAR AND PROGRAMMABLE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-054-9554, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
7537006P101
NSN: 5962-01-054-9554
FSC: 5962
CAGE: 99971 — LOCKHEED MARTIN CORP NAVAL ELECTRONICS & SURVEILLANCE SYSTEMS (USA)
SPECIFICATIONS
body_width0.285 INCHES MAXIMUM IN
body_height0.085 INCHES MAXIMUM IN
body_length0.440 INCHES MAXIMUM IN
features_providedMONOLITHIC AND BIPOLAR AND PROGRAMMABLE
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 150.0 CELSIUS DEGC
input_circuit_pattern10 INPUT
end_item_identificationMODEL E-2C ACFT
NSN5962-01-054-9554
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 7537006P101 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
MEMORY DEVICE TYPE: PROM
FEATURES PROVIDED: PROGRAMMED AND BIPOLAR AND MONOLITHIC
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
MEMORY DEVICE TYPEPROM
FEATURES PROVIDEDPROGRAMMED AND BIPOLAR AND MONOLITHIC
VERIFIED SUBSTITUTES & CROSS-REFERENCES 4
7541563G2Interchangeable
Same NIIN cross-reference
interchangeable
7541562G85Interchangeable
Same NIIN cross-reference
interchangeable
7543606G0002Interchangeable
Same NIIN cross-reference
interchangeable
7543606G2Interchangeable
Same NIIN cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 7537006P101?
7537006P101 is a MICROCIRCUIT,MEMORY.
What parts can replace 7537006P101?
There are 4 known substitutes for 7537006P101: 7541563G2, 7541562G85, 7543606G0002 and 1 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 7537006P101?
7537006P101 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-054-9554. This indicates validated use in U.S. government and defense supply chains.
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