7503603G006 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

7503603G006: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include inclosure_material: CERAMIC, memory_device_type: ROM, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC, inclosure_configuration: LEADLESS FLAT PACK, terminal_surface_treatment: SOLDER, terminal_type_and_quantity: 28 LEADLESS. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-418-4487, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

7503603G006

NSN: 5962-01-418-4487
FSC: 5962 — Microcircuits, Electronic
CAGE: 03538 — LOCKHEED MARTIN CORPORATION DIV RMS (USA)

SPECIFICATIONS

inclosure_material	CERAMIC
memory_device_type	ROM
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
inclosure_configuration	LEADLESS FLAT PACK
terminal_surface_treatment	SOLDER
terminal_type_and_quantity	28 LEADLESS
time_rating_per_chacteristic	50.00 NANOSECONDS MAXIMUM ACCESS NS
part_name_assigned_by_controlling_agency	PROGRAMMED EPROM
voltage_rating_and_type_per_characteristic	5.0 VOLTS NOMINAL POWER SOURCE
NSN	5962-01-418-4487

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

INCLOSURE CONFIGURATION: LEADLESS FLAT PACK

•

MEMORY DEVICE TYPE: ROM

•

VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.0 VOLTS NOMINAL POWER SOURCE

•

OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC

•

TERMINAL TYPE AND QUANTITY: 28 LEADLESS

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
INCLOSURE CONFIGURATION	LEADLESS FLAT PACK
MEMORY DEVICE TYPE	ROM
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	5.0 VOLTS NOMINAL POWER SOURCE
OPERATING TEMP RANGE	-55.0 TO 125.0 CELSIUS DEGC
PART NAME ASSIGNED BY CONTROLLING AGENCY	PROGRAMMED EPROM
TERMINAL TYPE AND QUANTITY	28 LEADLESS
TIME RATING PER CHACTERISTIC	50.00 NANOSECONDS MAXIMUM ACCESS NS

SUBSTITUTES & CROSS-REFERENCES 5

7503603G6Reference document

Same NSN cross-reference

Reference document — Secondary reference

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

CY7C265-50LMBReference document

Same NSN cross-reference

Reference document — Secondary reference

7503603G0006Reference document

Same NSN cross-reference

Reference document — Design control — primary reference

7555519P551Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

Ready to buy 7503603G006?

Compare prices from verified sellers on eBay

Buy on eBay →

As an eBay Partner, PartsTable may earn a commission. Your price is not affected.

FREQUENTLY ASKED QUESTIONS

What is 7503603G006?

7503603G006 is a MICROCIRCUIT,MEMORY.

What parts can replace 7503603G006?

There are 5 known substitutes for 7503603G006: 7503603G6, ROM/PROM, CY7C265-50LMB and 2 more. Substitute compatibility should be verified for your specific system.

What is the NSN for 7503603G006?

7503603G006 is cataloged in the U.S. Government catalog under NSN 5962-01-418-4487. This indicates validated use in U.S. government and defense supply chains.

Community Feedback

7503603G006 — MICROCIRCUIT,MEMORY

Request a Quote — 7503603G006