74S140: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.140 INCHES MAXIMUM IN, body_length: 0.785 INCHES MAXIMUM IN, features_provided: SCHOTTKY AND MONOLITHIC AND HERMETICALLY SEALED, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-034-2146, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN |
| body_height | 0.140 INCHES MAXIMUM IN |
| body_length | 0.785 INCHES MAXIMUM IN |
| features_provided | SCHOTTKY AND MONOLITHIC AND HERMETICALLY SEALED |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC AND GLASS |
| storage_temp_range | -65.0 TO 125.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | DUAL 4 INPUT |
| end_item_identification | HUDCRT CHASSIS FSCM 81755 |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-01-034-2146 |
| INPUT CIRCUIT PATTERN | DUAL 4 INPUT |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| DESIGN FUNCTION AND QUANTITY | 2 DRIVER, LINE AND 2 DRIVER, NAND |
| BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND SCHOTTKY AND POSITIVE OUTPUTS AND HIGH SPEED |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CASE OUTLINE SOURCE AND DESIGNATOR | D-1 MIL-M-38510 |
| SPECIFICATION/STANDARD DATA | 81349-MIL-M-38510/81 GOVERNMENT SPECIFICATION |