Socket type is critical: LGA 3647 vs SP3 vs SP5 are not interchangeable TDP tier determines heatsink requirement — Bronze vs Platinum differ
Pin 1 orientation must be correct — CPU dropped incorrectly = bent pins
PRODUCT OVERVIEW
IBM VRM Module for x236 x346 x366. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.