The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM IN, body_height: 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN, body_length: 0.660 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND LOW POWER, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-00-568-7382, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM IN |
| body_height | 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN |
| body_length | 0.660 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND LOW POWER |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | QUAD 2 INPUT |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| terminal_type_and_quantity | 14 PRINTED CIRCUIT |
| NSN | 5962-00-568-7382 |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| INPUT CIRCUIT PATTERN | QUAD 2 INPUT |
| BODY LENGTH | 0.770 INCHES MAXIMUM IN |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| DESIGN FUNCTION AND QUANTITY | 4 GATE, AND |
| OPERATING TEMP RANGE | -40.0 TO 85.0 CELSIUS DEGC |
| BODY HEIGHT | 0.130 INCHES NOMINAL IN |
| BODY WIDTH | 0.250 INCHES NOMINAL IN |
| MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |
| INCLOSURE MATERIAL | PLASTIC |